Miniaturisation, Durability and Multifunctionality in Focus | Omnetics Connector Innovations for Harsh Environments

Connectors are the silent enablers of modern electronic systems. They link power, data and signals in every subsystem, from sensors and control units to navigation and communication. In critical environments such as space or defence applications, a single unreliable connection can compromise an entire mission. To prevent this, connectors must operate flawlessly under exposure to extreme temperatures, mechanical stress, radiation and vibration, while also meeting strict standards like MIL-DTL-83513 and MIL-DTL-32139.

Meeting the challenges of miniaturisation, durability and multifunctionality

The continued evolution of satellites, UAVs, and advanced military systems is defined by three intertwined design goals: miniaturisation, durability, and multifunctionality. Together, they reflect the ongoing drive toward compact, efficient and intelligent electronic architectures.

Miniaturisation and SWaP optimisation

As systems become smaller and lighter, engineers face increasing SWaP (Size, Weight, and Power) constraints. Every gram and millimetre matter. Omnetics addresses this challenge with miniature and nano-scale connectors that maintain full electrical performance in extremely compact designs.

Miniaturisation is not just about saving space, it also enhances system efficiency. By reducing cabling complexity and signal paths, smaller connectors help improve overall speed and reliability. In high-density applications such as CubeSats, unmanned vehicles, and miniaturised payload electronics, Omnetics’ solutions demonstrate how precise mechanical design and materials expertise can advance both performance and integration density.

Micro 360® Circular Connectors

  • Robust and reliable flex-pin contact system from Omnetics.
  • 50 mil (1.27 mm) pitch between the pins, mated length < 12.4 mm.
  • Specified according to MIL-DTL-83513.
  • Compact mated length, ideal for high-density wiring applications.
  • Shielded cables offer protection against interference and cyberattacks.
  • Various housing types: plastic, separable, microscopically threaded metal housings, twist-lock and ACME ratchets.
  • Panel mount variants for portable electronics, resistant to heavy shocks, vibrations and IP68 sealed.
Miniaturisation, Durability and Multifunctionality in Focus | Omnetics Connector Innovations for Harsh Environments
Miniaturisation, Durability and Multifunctionality in Focus | Omnetics Connector Innovations for Harsh Environments

Nano 360® Circular Connectors

  • Robust and reliable flex-pin contact system from Omnetics.
  • 25 mil (0.64 mm) pitch between the pins, mated length 9.0 mm.
  • Specified according to MIL-DTL-32139.
  • Ultra-miniaturised circular connectors for applications requiring small, durable and powerful connections.
Miniaturisation, Durability and Multifunctionality in Focus | Omnetics Connector Innovations for Harsh Environments
Miniaturisation, Durability and Multifunctionality in Focus | Omnetics Connector Innovations for Harsh Environments

Durability through material science and design

Extreme environments demand long-term resilience. Omnetics enhances connector durability through materials such as liquid crystal polymer (LCP) insulators and high-grade metal alloys, which resist wear, corrosion, and thermal degradation.

Additional potting, sealing, and coating techniques provide protection against dust, humidity and shock, achieving IP68 sealing for even the most demanding applications. These materials and manufacturing processes are validated through vibration, thermal cycling, and radiation tests that simulate years of exposure in orbit or field conditions.

By combining proven mechanical robustness with advanced shielding, Omnetics connectors maintain performance stability over thousands of mating cycles, aligning with the highest Hi-Rel (High Reliability) requirements.

Multifunctionality and hybrid designs

In next-generation platforms, reducing mass and volume without losing capability is key. Hybrid connector architectures combine power, signal, and data transmission in one interface, enabling simultaneous energy and communication pathways through a single compact connector.

This approach simplifies wiring harnesses, increases vibration stability, and enhances EMI immunity. It also accelerates assembly and maintenance, especially in modular spacecraft systems. Hybrid designs are now central to satellite constellations, space robotics, and instrumentation modules, where efficiency and fault tolerance are equally critical.

Intelligent and modular connector technologies

Looking ahead, connector design is evolving beyond passive mechanical performance. Omnetics is exploring intelligent connectors that integrate sensors for real-time monitoring, capable of detecting temperature, vibration, or contact resistance anomalies before failures occur. This predictive capability opens the door to smart maintenance strategies, reducing downtime and cost in space and defence programs.

At the same time, modular architectures are enabling custom configurations tailored to unique mission requirements, supporting flexible layouts and faster system integration.

Omnetics and MSA Components: Reliable connections for future missions

MSA Components supports European and international customers in selecting and integrating Omnetics’ miniature and hybrid connectors across space-qualified systems. Together with Hi-Rel Solutions by Steliau Technology and partners including Exxelia, 3D Plus, and Omnetics, MSA Components contributes to advancing high-reliability electronic systems across industries.

From concept to qualification, the shared focus remains clear: maximise reliability, reduce risk, and ensure mission longevity. In orbit. On land. And beyond.

Omnetics and MSA Components at Space Tech Expo Europe 2025

This year, the MSA Components team and Omnetics representatives will once again be at Space Tech Expo Europe 2024, where you can find out about the latest innovations in the field of connectors, as well as other technological advances and current products.

Note for visitors: Our team will be on site at Booth F11, together with our partners 3D PLUS, Omnetics, and Exxelia.

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