
• Transfer-moulded encapsulation for higher reliability
• Power input max. 250 mW
• Isolation prim. to sec. 500 VDC minimum
• Suitable for IR and vapor reflow soldering
• SMD or through-hole cases
• Bandwidth : 100 KHz to 400 MHz
• Operating temperature – 55 °C to + 125 °C
• Weight : 1.5 grams
• Shielded version upon request
PERSONAL CONSULTATION
From component selection to design-in: our sales team advises you in person, by phone, video call or on site. We will set aside 30 minutes for you.
PERSÖNLICHE BERATUNG
Von der Bauteilauswahl bis zum Design-in: Unser Vertriebsteam berät Sie persönlich, telefonisch, per Videokonferenz oder vor Ort. Wir nehmen uns 30 Minuten Zeit.