FUSIO RT - Wallpaper

FUSIO RT Computer Core from 3D PLUS

The FUSIO RT family offers a reprogrammable Rad Hard By Design (RHBD) SRAM-based FPGA featuring high-reliability embedded memories, including a 128 Mbit TMR configuration memory and optional computing and data storage memories, all integrated into a single miniaturized package. FUSIO RT products are perfect for system applications demanding performance, density, and high reliability, such as telecommunication satellites or experimental instruments.

Fusio-RT from 3D PLUS
FUSIO RT Computer Core from 3D PLUS
Fusio RT - European reprogrammable FPGA ressources
FUSIO RT Computer Core from 3D PLUS
  • 263 users I/Os
  • 800 Mbps I/O support
  • 550k ASIC gates equivalent to 4 400 000 system gates
Fusio RT - Modularity, upgradable computer core
FUSIO RT Computer Core from 3D PLUS
  • one footprint for 4 configurations
  • High level of miniaturization: 483 balls
  • BGA, (32 x 32) mm² area
Fusio RT - Enhanced radiation performances
FUSIO RT Computer Core from 3D PLUS
  • TID > 40 krad (Si)
  • SEL LET > 60 MeV.cm²/mg

In most computer boards or processing units, the common design includes an FPGA with its boot memory, computing memory, and storage memory. The FUSIO RT aims to offer a reusable, mature space computing core that integrates all these necessary elements. This design reduces the board area, provides a verified radiation-hardened design, and qualifies as a ready-to-use whole module.

FUSIO RT Family
FUSIO RT Computer Core from 3D PLUS

the Fusio-RT from 3D PLUS and their configurations?  

the Fusio-RT from 3D PLUS and their configurations?  

FUSIO RT - Basic
FUSIO RT Computer Core from 3D PLUS

The FUSIO RT BASIC is the basic configuration of a Computer Core that integrates a space-grade SRAM-based FPGA along with its configuration memory. This solution provides several key benefits, including the use of a leading-edge European FPGA, a significant reduction in board area for customer designs, and high modularity with pinout compatibility across the entire FUSIO RT Family. Additionally, it features a proven radiation-hardened design.

The FUSIO RT BASIC is designed for high-speed circuit applications. It is particularly well-suited for high-reliability, high-performance, and high-density system applications, serving as a fully integrated Computer Core.

FUSIO RT Computer Core from 3D PLUS
FUSIO RT Computer Core from 3D PLUS

The FUSIO RT 3L NAND is the three-layer configuration of a Computer Core, integrating a space-grade SRAM-based FPGA, its configuration memory, and an additional mass storage memory NAND into one miniaturized module. This solution offers several key benefits, including the use of a leading-edge European FPGA, a significant reduction in board area for customer designs, and high modularity with pinout compatibility across the entire FUSIO RT Family. Additionally, it features a proven radiation-hardened design.

The FUSIO RT 3L NAND is designed for high-speed circuit applications. It is particularly well-suited for high-reliability, high-performance, and high-density system applications, serving as a fully integrated Computer Core.

FUSIO RT - SDRAM
FUSIO RT Computer Core from 3D PLUS

The FUSIO RT 3L SDRAM is a three-layer computer core configuration that combines a space-saving SRAM-based FPGA, its configuration memory, and additional SDRAM computer memory in a compact module. This solution offers several advantages, including the use of a state-of-the-art European FPGA, significant board space reduction for customer designs, high modularity with pin-out compatibility across the entire FUSIO RT family, and a proven radiation-hardened design.

The FUSIO RT 3L SDRAM is optimized for high-speed circuit applications. It excels in high reliability, high performance and high density system applications, functioning as a fully integrated computer core.

FUSIO RT - Full
FUSIO RT Computer Core from 3D PLUS

The FUSIO RT FULL is a complete reconfigurable Computer Core that integrates a space-grade SRAM-based FPGA, its configuration memory, and additional computing and mass storage memory into one miniaturized module. This all-in-one solution offers several key benefits, including the use of a leading-edge European FPGA, a significant reduction in board area for customer designs, high modularity with pinout compatibility across the entire FUSIO RT Family, and a proven radiation-hardened design.

The FUSIO RT FULL is designed for high-speed circuit applications. It is particularly well-suited for high-reliability, high-performance, and high-density system applications, serving as a fully integrated Computer Core.

Each 3D PLUS standard product and SiP solution is identified by a specific part number according to the part number decoder provided below. To fully define a product, the ordering information must include at least the following three items: the product’s part number, the temperature range, and the quality grade. For High Reliability products or SiPs intended for Aerospace applications, a Source Control Drawing (SCD#) referenced as 3DPA-xxxx is available for each product. This drawing must be used for procurement in addition to the other ordering information.

Product Part Number Description Package Temperature
FUSIO RT BASIC 3DMC0753 Space computer core with embedded RHBD FPGA NX1H35AS and 128Mb TMR Flash NOR 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
FUSIO RT NAND 3DMC0754 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 64 Gb NAND Flash 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
FUSIO RT SDRAM 3DMC0755 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 2 Gb SDRAM 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
FUSIO RT SDRAM 3DMC0752 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR, 64 Gb NAND Flash and 2 Gb SDRAM 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
\\NAS35A133\Datenaustausch intern\MSA Components\2024\Showcase\FUSIO RT - 3D PLUS\Web optimierte Bilder
FUSIO RT Computer Core from 3D PLUS
  • 1

  • 2

  • 3

  • 4

  • 5

  • 6

  • 7

  • 8

MC : Computer

PM : Power module

MS : System In Package

XXXX : Design Product number

1 : First design

x :

1 : First design

x :

N : Commercial Grade

B : Industrial Grade

S : Space Grade

0 : The Space Quality Grade corresponds to the ESA Qualified Quality Grade for Space applications (Category 1 hybrid Manufacturer as per ECSS-Q-ST-60-05C).

P : The Space Quality Grade corresponds to the NASA PEM Selection, Screening and Qualification Flow ref. PEM-INST-002

Y : The Space Quality Grade corresponds to the Class Y Screening and Qualification Flow.

H : The Industrial Quality Grade corresponds to the Class H Screening and Qualification Flow of the MIL-PRF-38534.

C : Custom screening as per Custom Product Detail Specification.

R : Radiation Data Tested

A : Generic Radiation Data Available

0 : Not Applicable

: No Option

A : “ARATHANE” Finish

S : “SOLITHANE 113” Finish

L : SnPb termination

M : "MAPSIL” Finish

T : TANTALUM Shielding

G : Gullwing

Each 3D PLUS standard product and SiP solution is identified by a specific part number according to the part number decoder provided below. To fully define a product, the ordering information must include at least the following three items: the product’s part number, the temperature range, and the quality grade. For High Reliability products or SiPs intended for Aerospace applications, a Source Control Drawing (SCD#) referenced as 3DPA-xxxx is available for each product. This drawing must be used for procurement in addition to the other ordering information.

For these products following encodings are important:
Module Type:
MC - Computer

Product Number (following the Module Type):
xxxx - Design Product number

4Mpx Visible 12Mpx Visible 1.3MPX SWIR
FUSIO RT BASIC 3DMC0753 Space computer core with embedded RHBD FPGA NX1H35AS and 128Mb TMR Flash NOR 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
FUSIO RT NAND 3DMC0754 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 64 Gb NAND Flash 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
FUSIO RT SDRAM 3DMC0755 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR and 2 Gb SDRAM 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
FUSIO RT SDRAM 3DMC0752 Space computer core with embedded RHBD FPGA NX1H35AS, 128Mb TMR Flash NOR, 64 Gb NAND Flash and 2 Gb SDRAM 483 balls BGA
Pitch 1.27mm
-40 °C to +105 °C
\\NAS35A133\Datenaustausch intern\MSA Components\2024\Showcase\FUSIO RT - 3D PLUS\Web optimierte Bilder
FUSIO RT Computer Core from 3D PLUS
  • 1

  • 2

  • 3

  • 4

  • 5

  • 6

  • 7

  • 8

MC : Computer

PM : Power module

MS : System In Package

XXXX : Design Product number

1 : First design

x :

1 : First design

x :

N : Commercial Grade

B : Industrial Grade

S : Space Grade

0 : The Space Quality Grade corresponds to the ESA Qualified Quality Grade for Space applications (Category 1 hybrid Manufacturer as per ECSS-Q-ST-60-05C).

P : The Space Quality Grade corresponds to the NASA PEM Selection, Screening and Qualification Flow ref. PEM-INST-002

Y : The Space Quality Grade corresponds to the Class Y Screening and Qualification Flow.

H : The Industrial Quality Grade corresponds to the Class H Screening and Qualification Flow of the MIL-PRF-38534.

C : Custom screening as per Custom Product Detail Specification.

R : Radiation Data Tested

A : Generic Radiation Data Available

0 : Not Applicable

: No Option

A : “ARATHANE” Finish

S : “SOLITHANE 113” Finish

L : SnPb termination

M : "MAPSIL” Finish

T : TANTALUM Shielding

G : Gullwing

the Fusio-RT from 3D PLUS and their configurations?  

the Fusio-RT from 3D PLUS and their configurations?  

On May 3, 2024, the Chinese space mission Chang'e 6 launched to the dark side of the moon, marking an important milestone for 3D PLUS and the FUSIO RT product line.

This space mission is the first space flight of one of the new reprogrammable and ultra-rugged FPGAs from Europe, as the FUSIO RT component and other 3D PLUS products such as RIMC SDRAM and POL converter are on board the Chang'e 6 spacecraft in the French DORN instrument.

This milestone for FUSIO RT is a testament to the commitment and expertise of everyone involved at 3D PLUS and sets a new standard for space components.

The picture shows an image of China's Chang'e-6 landing on moon's far side to collect samples.

China's Chang'e-6 lands on moon's far side to collect samples - Credits CNSA
FUSIO RT Computer Core from 3D PLUS

Credits: CNSA

FUSIO RT Computer Core from 3D PLUS

If you would like general information about the FUSIO RT Computer Core family from our supplier 3D PLUS, please contact our team directly or arrange a callback.

FUSIO RT Computer Core from 3D PLUS

If you require one of the FUSIO RT Computer Core family from our supplier 3D PLUS for one of your projects or would like advice on the technology regarding certain specifications, we will be happy to offer you a solution in person.

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