The FUSIO RT family offers a reprogrammable Rad Hard By Design (RHBD) SRAM-based FPGA featuring high-reliability embedded memories, including a 128 Mbit TMR configuration memory and optional computing and data storage memories, all integrated into a single miniaturized package. FUSIO RT products are perfect for system applications demanding performance, density, and high reliability, such as telecommunication satellites or experimental instruments.
In most computer boards or processing units, the common design includes an FPGA with its boot memory, computing memory, and storage memory. The FUSIO RT aims to offer a reusable, mature space computing core that integrates all these necessary elements. This design reduces the board area, provides a verified radiation-hardened design, and qualifies as a ready-to-use whole module.
The FUSIO RT BASIC is the basic configuration of a Computer Core that integrates a space-grade SRAM-based FPGA along with its configuration memory. This solution provides several key benefits, including the use of a leading-edge European FPGA, a significant reduction in board area for customer designs, and high modularity with pinout compatibility across the entire FUSIO RT Family. Additionally, it features a proven radiation-hardened design.
The FUSIO RT BASIC is designed for high-speed circuit applications. It is particularly well-suited for high-reliability, high-performance, and high-density system applications, serving as a fully integrated Computer Core.
The FUSIO RT 3L NAND is the three-layer configuration of a Computer Core, integrating a space-grade SRAM-based FPGA, its configuration memory, and an additional mass storage memory NAND into one miniaturized module. This solution offers several key benefits, including the use of a leading-edge European FPGA, a significant reduction in board area for customer designs, and high modularity with pinout compatibility across the entire FUSIO RT Family. Additionally, it features a proven radiation-hardened design.
The FUSIO RT 3L NAND is designed for high-speed circuit applications. It is particularly well-suited for high-reliability, high-performance, and high-density system applications, serving as a fully integrated Computer Core.
The FUSIO RT 3L SDRAM is a three-layer computer core configuration that combines a space-saving SRAM-based FPGA, its configuration memory, and additional SDRAM computer memory in a compact module. This solution offers several advantages, including the use of a state-of-the-art European FPGA, significant board space reduction for customer designs, high modularity with pin-out compatibility across the entire FUSIO RT family, and a proven radiation-hardened design.
The FUSIO RT 3L SDRAM is optimized for high-speed circuit applications. It excels in high reliability, high performance and high density system applications, functioning as a fully integrated computer core.
The FUSIO RT FULL is a complete reconfigurable Computer Core that integrates a space-grade SRAM-based FPGA, its configuration memory, and additional computing and mass storage memory into one miniaturized module. This all-in-one solution offers several key benefits, including the use of a leading-edge European FPGA, a significant reduction in board area for customer designs, high modularity with pinout compatibility across the entire FUSIO RT Family, and a proven radiation-hardened design.
The FUSIO RT FULL is designed for high-speed circuit applications. It is particularly well-suited for high-reliability, high-performance, and high-density system applications, serving as a fully integrated Computer Core.
On May 3, 2024, the Chinese space mission Chang'e 6 launched to the dark side of the moon, marking an important milestone for 3D PLUS and the FUSIO RT product line.
This space mission is the first space flight of one of the new reprogrammable and ultra-rugged FPGAs from Europe, as the FUSIO RT component and other 3D PLUS products such as RIMC SDRAM and POL converter are on board the Chang'e 6 spacecraft in the French DORN instrument.
This milestone for FUSIO RT is a testament to the commitment and expertise of everyone involved at 3D PLUS and sets a new standard for space components.
The picture shows an image of China's Chang'e-6 landing on moon's far side to collect samples.
Credits: CNSA
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