The CASPEX Space Camera Head family from 3D PLUS delivers high-resolution, high-performance camera heads designed for space applications. Utilizing 3D PLUS packaging technology, each camera head incorporates a high-performance image sensor along with a user-reconfigurable FPGA-based electronic architecture. This setup enables configurable embedded image processing and formatting, ensuring versatile and adaptable use for various space missions.
Our supplier 3D PLUS offers standard CASPEX 4 Megapixels camera heads family as 4M, 12M, and SWIR ready-to-use camera heads, providing our customers with time and cost savings of up to 90% compared to custom camera head designs. These camera heads feature a highly miniaturized generic optoelectronic core and can capture both visible and SWIR wavelengths, making them ideal for scientific and imaging applications.
Additionally, we provide the 3D PLUS standard CASPEX 4 Megapixels camera heads family. The CASPEX 4 Megapixels camera head, manufactured by 3D PLUS for over five years, boasts a successful space heritage, having been used in projects such as SuperCam, LICIACube, and SPEXone.
The CASPEX 4M Space Camera Head integrates all essential components to operate its 4-megapixel CMOS image sensor and FPGA within the constraints of a space environment. This includes DC-DC converters, latch-up protection, processing, and storage memories, all compacted into a 35x35x23mm^3 module. The camera head's design ensures optimal integration into space optical instruments through its dedicated optical, mechanical, and thermal interfaces.
This camera head has been chosen for numerous missions, including NASA's Mars Sample Return program (SuperCam, MSR-ERO, MSR-STA), and has been in use since 2019, demonstrating its reliability in space.
The CASPEX 12M Space Camera Head incorporates all necessary components to operate its 12-megapixel low-noise CMOS image sensor and high-performance FPGA-based architecture within the constraints of a space environment. This includes DC-DC converters, processing, and storage memories, all compacted into a 40x40x39mm^3 module.
The camera head's design ensures seamless integration into space optical instruments through dedicated optical, mechanical, and thermal interfaces, along with an additional thermal interface dedicated to the processing architecture, allowing efficient separation between the sensing and processing components.
The CASPEX SWIR Space Camera Head integrates all necessary components to operate its 1.3-megapixel InGaAs SWIR image sensor and high-performance FPGA-based architecture within a space environment. This includes DC-DC converters, processing, and storage memories, all within a compact 40x40x45mm^3 module.
The design of the CASPEX SWIR Space Camera Head provides dedicated optical, mechanical, and thermal interfaces for seamless integration into space optical instruments, along with an additional thermal interface dedicated to the processing architecture, allowing efficient separation between the sensing and processing components of the camera head.
Camera evaluation kits provide a ready-to-use environment for evaluating and prototyping with 3D PLUS camera head products. These kits include both hardware and software tools to facilitate the use and integration of the camera heads. They allow for the configuration and operation of the camera heads within a test environment, such as instrument integration, optical benches, and testing facilities.
If you would like general information about standard cameras heads CASPEX from our supplier 3D PLUS, please contact our team directly or arrange a callback.
If you require space cameras or camera heads from our supplier 3D PLUS for one of your projects or would like advice on the technology regarding certain specifications, we will be happy to offer you a solution in person.
