News

Your industry is very exciting and dynamic, so we would like to inform you about current topics in the field of active components, passive components, interconnect and integrated solutions, but also report on the latest news from MSA Components.
MSA-Components at the Space Tech Expo Europe 2023 in Bremen
MSA-Components at the Space Tech Expo Europe 2023 in Bremen Europe's largest B2B event for the space industry returns to Bremen for its 6th edition on November 14-16. Space Tech Expo Europe offers companies the opportunity to experience the latest technology innovations and to network face-to-face w...
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MSA-Components at the European Space Power Conference 2023 (ESPC) in Spain
MSA-Components at the European Space Power Conference 2023 (ESPC) in Spain MSA Components GmbH will be exhibiting at this year's ESPC 2023, the 13th European Space Power Conference. ESPC is a major international event covering all aspects of the most important topics in electrical power for space ap...
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New radiation-resistant camera heads for space applications as an all-in-one solution
New radiation-resistant camera heads for space applications as an all-in-one solution Last but not least, we would like to introduce an innovative range of camera heads as an all-in-one solution. The camera head systems are an integrated solution of sensor, image processing, power supply, protection...
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MNEMOSYNE: A non-volatile memory designed for space constraints and harsh environments in space applications
MNEMOSYNE: A non-volatile memory designed for space constraints and harsh environments in space applications We are very pleased to present you an innovative storage solution of the latest generation, completely developed and produced in Europe. Its unique features offer a completely new solution to...
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The COMBO module from 3D PLUS provides all the necessary hardware resources for booting SRAM-based FPGA with the smallest PCB footprint available on the market
The COMBO module from 3D PLUS provides all the necessary hardware resources for booting SRAM-based FPGA with the smallest PCB footprint available on the market Currently, there is a large gap in the supply of reliable configuration memory boot managers (COMBO) for SRAM-based FPGA modules in the mark...
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New 64Gbit x72bits DDR4 memory module from 3D Plus / Meets MIL-STD-810
New 64Gbit x72bits DDR4 memory module from 3D Plus / Meets MIL-STD-810 The newly developed memory series for the defense sector from our manufacturer 3D Plus, is henceforth extended by a new 64Gbit x72bits DDR4 SDRAM. This state-of-the-art memory module offers exceptional performance, capacity and r...
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New supplier for cables: greatest possible complexity and quantities from 1 piece
New supplier for cables: greatest possible complexity and quantities from 1 piece Some time ago, we were able to expand our network also in the field of cable assembly with a new manufacturer, based in Germany, with excellent solutions. With this cooperation, we are expanding our capacity to supply ...
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New MIL-STD-883 compliant SRAM, EEPROM and LOGIC FCT and FCT-T product lines with lead times of 5-6 weeks
New MIL-STD-883 compliant SRAM, EEPROM and LOGIC FCT and FCT-T product lines with lead times of 5-6 weeks Recently we have been able to expand our network with another reliable partner. With this partnership we can now offer more components and product series for MIL-STD-883 compliant SRAMs and EEPR...
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