MAIN CHARACTERISTICS
Dielectric: Ceramic class 1
Technology:
C 48• Multilayer chips
C 48• P/PL/L Surface mount DIL connect.
C 48• R Surface mount ribbons
C 48• N Straight DIL connections
TCL 48• Cu tinned wire / varnished
TCF 48• Cu tinned wire / epoxy dipped
TCK 48• Cu tinned wire / epoxy molded
Climatic category: 55/125/56
Capac. temp. charact.: –2200 ppm ±500
Operating temperature: –55 °C +125 °C
Rated voltage URC: 500 V to 5000 V
C 48• P/PL/L Surface mount DIL connect.
C 48• R Surface mount ribbons
C 48• N Straight DIL connections
TCL 48• Cu tinned wire / varnished
TCF 48• Cu tinned wire / epoxy dipped
TCK 48• Cu tinned wire / epoxy molded
Climatic category: 55/125/56
Capac. temp. charact.: –2200 ppm ±500
Operating temperature: –55 °C +125 °C
Rated voltage URC: 500 V to 5000 V