The 3DFN64G08VB1388 is a 3.0V single power high density non-volatile NAND flash memory based on 2 two 32Gb basic components.
It is organized as 2 x 4G x 8 bits based on 2 dies of 4096 blocks of 128 pages of 8192+448 bytes offering a total of 8G x 8 bits with spare 448M x 8 capacity. It is organized in 2 ranks with separate chip enable (CE#) and Ready/Busy (R/B#) controls. This organization is fully compliant with ONFI 2.2 standard.
The on-chip Program/Erase controller automates all program and erase functions including pulse repetition, where required, and internal verification and margining of data. The overall operation can be monitored through the operation status bytes.
Write-intensive systems can take advantage of the module extended reliability by providing ECC with real time mapping out algorithm.
Thanks to the high-density patented technology and the cold manufacturing process, the 3DFN64G08VB1388 does integrate NAND Flash in a small form factor package without compromising electrical or thermal performance.
The 3DFN64G08VB1388 is packaged in a 52 pads LGA and available in industrial, military and extended temperature range.
This datasheet revision takes into account the addition of 175°C temperature grade, the timings and current specifications are preliminary and subject to change.
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