3D Plus

Productfields:

Active Components, Integrated Solutions

Main markets:

Defence, Space

Productfields:

Active Components, Integrated Solutions

Main markets:

Defence, Space

3D PLUS is a world-leading supplier of advanced high-density 3D microelectronic products and die/wafer stacking technology. Their products meet the demand for high reliability, high performance, and very small size in today’s and tomorrow’s electronics.

3D PLUS has been recognized for its innovation in the design and manufacturing of miniaturized 3D modules for more than 25 years. Their technology enables stacking heterogeneous active, passive, and opto-electronic devices in a single highly miniaturized package.

3D PLUS offers high reliability and high-performance innovative products thanks to a strong design activity of complex electronic modules and a high level of technical capability in various areas such as digital, analog, and IP CORES. These abilities, combined with a strong Space Radiation expertise, enable them to bring key advantages for all kinds of space missions with a very high level of guarantee.

3D PLUS standard products and custom solutions bring breakthrough advantages to their customers’ electronic designs. They are used in diverse computer boards, data recorders boards, and custom applications for buses and payloads. Their flight heritage is expanding continuously with products launched in Space every month in GEO, MEO, and LEO orbits, for deep space exploration missions, for satellite constellation fleets, and for governmental missions.

Overview / Table of Content

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Sales contact for 3D Plus

Mr. Michael Schulte

Call:

+49 2722 6373 10

Mail:

michael.schulte@msa-components.com

Markets and Application Areas

3D PLUS is a leading supplier of high-performance microelectronic components for the defense and space markets. In the defense sector, they provide advanced 3D stacked memory modules, radiation-hardened components, and high-density packaging solutions designed to meet stringent military standards for reliability and durability. For space applications, 3D PLUS offers space-grade memory, data processing units, and power management systems essential for satellite and spacecraft missions. Their innovative 3D packaging technology ensures compact, lightweight, and robust solutions, making them a preferred choice for critical applications in these highly demanding environments.

All certificates of 3D Plus

- ESA PROCESS CAPABILITY APPROVAL N°351C

- ISO 9001

Products from 3D PLUS for the space market

Renowned for their electrical performance, miniaturization, quality, high reliability, and radiation assurance levels (TID, SEL, SEU), 3D PLUS space-qualified products and custom SiPs are utilized globally across all space application fields, including telecommunications, navigation, Earth observation, climate monitoring, space transportation, and science.

With over 210,000 modules in space as of 2024 and more than 25 years of flight heritage with zero failures, 3D PLUS stands as Europe's largest manufacturer of hybrid space-qualified catalog products and custom system-in-packages (SiPs).

Defence

Military Aircraft

Missiles

Radar

Space

Traditional Space

Need more information about the markets and Application Areas of 3D Plus?

If you need detailed information about specific products or services of 3D Plus, please call us or send us an email with your contact information. Our team will respond quickly.

Call Us

Mail Us

Michael Schulte

Managing Director

Call +49 2722 6373 10 michael.schulte@msa-components.com

Productcategories

Camera Heads

3D PLUS Camera Heads Family offers high density, high performance and high resolution CMOS camera solutions for space applications. These solutions bring together a high resolution CMOS image sensor with an FPGA-based electronic architecture for control of the sensor, image preprocessing, and interfacing of the camera with a space equipment.

Volatile Memory

3D PLUS's space-qualified portfolio includes a wide range of volatile memories such as SRAM, SDRAM, and DDR1 through DDR4. These products are recognized for their high density, speed, reliability, radiation tolerance, and compact form factors. For example, the DDR4 SDRAM offers higher speed and lower power consumption compared to DDR3. Available in capacities from 16 Gb to 64 Gb, these radiation-tolerant modules are organized as x48b or x72b and operate on a 1.2 V power supply. Like DDR3, the DDR4 modules feature an optimized design with embedded decoupling capacitors and termination resistors. They come in BGA packages, ensuring high resistance to harsh thermal and mechanical environments and suitability for Surface Mount Technology (SMT) assembly.

Non Volatile Memory

3D PLUS's space-qualified portfolio includes a wide range of non-volatile memories, such as PROM, MRAM, and FLASH. These products are recognized for their high density, speed, reliability, radiation tolerance, and compact form factors. One notable example is MNEMOSYNE, a non-volatile memory ASIC derived from the EU's H2020-funded project of the same name, launched in 2019. This project aimed to develop a memory ASIC with a serial interface tailored for space constraints, with a guaranteed supply chain entirely within Europe. The ASIC was cross-validated by a consortium of experts in radiation effects and space electronics.

Configuration Memory Boot Manager

The space-grade Configuration Memory Boot Manager (COMBO) is designed to boot SRAM-based FPGAs and MPSoCs that require large configuration memory. To address the need for higher density configuration memory, multiple bitstream images, and in-orbit reconfigurability, we offer the COMBO family. This unique space-grade solution integrates all necessary hardware and firmware resources into a single module, featuring the smallest PCB form factor available on the market. 3D PLUS’s COMBO module provides an unparalleled solution by combining all required hardware resources into a single module to boot SRAM-based FPGAs, all while maintaining the smallest PCB footprint in the market.

reconfigurable Computer Core

The FUSIO RT family provides a reprogrammable space grade SRAM based FPGA and high reliability embedded memories: a 128 Mbit TMR RHBD configuration memory plus optional computing and mass data storage memories. These functions are provided in one single miniaturized package, allowing simple design, cost reductions and minituarisation at board and equipment levels.

Front-end-Converter

The 3DPM0460 Front-End DC/DC converter, utilizing GaN transistor technology, is universally compatible with satellite primary buses. It efficiently converts primary bus voltages to the required DC values, eliminating the necessity for intermediate converters and ensuring high efficiency across all configurations. With an input range spanning from 20V to 110V, it delivers isolated secondary voltage with a maximum output power of 50W. Additionally, all filters are integrated within the module for streamlined operation.

POL Converter

3D PLUS PoL Converter modules provide high performances, high reliability, compact size and low weight for space applications. They are an excellent solution for low voltage power distribution systems designed around high-speed digital electronics. All input and output filters come integrated within the module. Its output voltage can be adjusted by use of an external resistor.

LVDS

3D PLUS offers Radiation Tolerant Low Voltage Differential Signal (LVDS) line drivers and receivers featuring 4 or 8 LVDS channels within a single highly miniaturized package, maximizing area and weight savings for Space application board designs. They are available in various temperature ranges and operate with a single power supply of 3.3V. These devices come with a standard SOP footprint, ensuring resilience for Surface Mount Technology (SMT) assembly and durability in harsh thermal and mechanical conditions. Utilized for high-speed point-to-point interfaces, 3D PLUS LVDS products serve a range of high-performance digital electronics applications across various space sectors, including sciences, deep space missions, Earth observation, navigation, and launch and manned space vehicles.

LVT

3D PLUS introduces radiation-hardened Low Voltage Technology (LVT) line dual 16-bit transceivers and level shifters, compactly packaged for maximum space and weight savings in Space application board designs. These units, optimized for low power usage and high speed, support cold sparing and bus hold functions, enabling two-way asynchronous communication between buses (address, data). They feature a standard SOP footprint for robust Surface Mount Technology (SMT) assembly and resilience in challenging thermal and mechanical conditions. The LVT product line offers diverse supply voltages to meet high reliability requirements in various space applications, including GEO stationary missions, Earth observation, navigation, manned space vehicles, and deep space exploration.

Current Limiter

In the Space environment, high-performance semiconductor devices may be vulnerable to the rare but potentially destructive Single Event Latch-Up (SEL) effect induced by radiation exposure. To ensure reliability and longevity, mission-critical Space applications require protection against SEL. The 3DPM0168 Latch-Up Current Limiter (LCL) safeguards semiconductor devices by monitoring the power supply line and instantly shutting it off in the event of overcurrent or "radiation-induced SEL," preventing overheating. Designed with specific radiation mitigation techniques and adherence to Space design derating rules, the ITAR Free 3DPM0168 LCL is Rad-Hard-by-Design, boasting SEL/SEE LETth of 80 MeV-cm²/mg and a TID of 50 krad(Si).

Switch

The 3DPM0356-1 Switch module safeguards the supply line, preventing failure spread and pinpointing upstream issues. In complex digital systems like those with FPGAs, swift power down is vital to prevent component damage. Upon detecting over-current events, the module swiftly cuts off downstream power to shield loads. Current threshold adjustment is possible via an external resistor (RADJ). System re-powering is managed through digital signals via external inputs, EN and OVP#. Designed for Space, it offers high reliability, radiation tolerance, compactness, and lightness, with SEL/SET LETth of 62.5 MeV.cm2/mg and TID of 50 krad (Si).

Termination Regulator

The DDR2, 3, and 4 Termination Regulator (TR) modules are compact, flexible, and Rad-Hard-by-Design, ideal for low-input voltage, low-noise Double Data Rate (DDR) memories. They ensure fast transient response times, offer remote sensing functionality, support Command pin control, and fulfill all power requirements for DDR VTT bus designs. Incorporating radiation effect mitigation techniques, these modules are the ideal choice for DDR memories in high-reliability applications. Manufactured with 3D PLUS's Space qualified stacking technology for high reliability, they are available in a compact, lightweight package.

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Featured Products for 3D Plus

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Latching Bi-Lobe® Nano-D Connectors

Available in pin counts from 9-65, latching Bi-Lobes® can be configured with discrete wires, overmolded cable, panel mount housings and PCB mounted versions.

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SDRAM Industrial Grade Memory Stacks

These SDRAM based products offer a high density memory solution that meets wide data bus requirements necessary for high reliability defense and avionics applications.

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MRAM Space Grade Radiation Tolerant Memory Stacks

The Magneto-resistive Random Access Memory (MRAM) stores data using magnetic polarization rather than electric charge, which brings the MRAM unlimited Read/Write endurance and Single Event Upset (SEU) immune characteristics.

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PROM Space Grade Radiation Tolerant Memory Stacks

PROM memories are a One-Time-only programmable non volatile memories. 32Mb to 64 Mb Radiation Tolerant PROM stacks are available in a variety of temperature ranges, organized x8 and with a power supply of 3.3V.

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EEPROM Space Grade Radiation Tolerant Memory Stacks

The Electrically Erasable and Programmable ROM (EEPROM) stacks enable on-board and in-orbit programming capability for the high density non volatile memories.

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Featured News for 3D Plus

Fusio RT Computer Core from 3D PLUS: Technological Advancement for Demanding Space Applications

Fusio RT Computer Core from 3D PLUS: Technological Advancement for Demanding Space Applications The Fusio RT Computer Core from 3D PLUS represents the cutting edge of radiation-tolerant computing cores.

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Space cameras for video and imaging from 3D PLUS

The space camera family from our supplier 3D PLUS offers standard products for a wide range of space imaging applications. Using highly reliable and qualified components and widely available communication interfaces, the 3D PLUS space camera family is an efficient and competitive choice for all space missions.

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Space Cameras - Related Products

With our supplier 3D PLUS and their successful product line of generic space camera heads, we can offer numerous standard solutions for your optical instruments. The camera heads provide the required performance and miniaturization for specific applications that are required for highly constrained missions and cannot be covered by our range of space cameras.

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Known applications of 3D PLUS space cameras

The space cameras from our supplier 3D PLUS have been successfully used in several missions by NASA or other organizations in various space projects. In this overview, we would like to briefly introduce you to some of these projects and how the space cameras from 3D PLUS were used and under what conditions they operated.

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