3D Plus

The CASPEX family comprises high-resolution, high-performance, space-grade camera heads engineered for demanding space applications. Built on 3D PLUS’s advanced packaging technology, each camera head combines a high-resolution image sensor with a user-reconfigurable FPGA-based electronic architecture. This flexible design enables configurable onboard image processing and interface capabilities, allowing the camera heads to be tailored to a wide range of mission requirements.

The IRIS Camera family provides standard, space-qualified imaging solutions for diverse space applications. Based on 3D PLUS’s proven CASPEX 4Mpx camera heads, each camera integrates a high-performance sensor, FPGA-based electronics, space-grade optics, and a robust mechanical enclosure into a complete imaging system.

Featuring a SpaceWire interface and a 5 mm-thick aluminum housing, IRIS cameras provide enhanced radiation protection and efficient mechanical and thermal integration. With multiple optical configurations available, they support applications including scientific imaging, monitoring, star tracking, and navigation. Qualified for LEO, GEO, and deep-space missions, IRIS cameras benefit from proven CASPEX flight heritage.

The MCAM Monitoring System is a space-qualified multi-camera solution designed to capture images and low-rate color video sequences for monitoring critical events on complex space platforms. It supports applications such as solar panel and antenna deployment monitoring, component separation, payload observation, and mission-specific event tracking. The 3D PLUS MCAM system can control and operate up to seven IRIS cameras through a single compact control unit, providing a flexible and reliable solution for spacecraft monitoring needs.

ASTERIA is 3D PLUS’ latest-generation space camera, designed to address the demanding requirements of exploration, surveillance, and scientific missions. Combining high-resolution imaging, advanced performance, and space-hardened reliability, this ultra-miniaturized camera delivers a low SWaP-C (Size, Weight, Power, and Cost) solution. Engineered for operation in extreme space environments, ASTERIA provides reliable and efficient imaging capabilities for satellite platforms, deep-space missions, and Earth observation applications.

3D PLUS DDR2 SDRAM provides enhanced performance with higher data rates and lower power consumption compared to conventional DDR SDRAM. Available in capacities from 1 Gb to 8 Gb, these radiation-tolerant space memories are offered in x8, x48, and x72 configurations with a 1.8 V power supply. Integrated decoupling capacitors ensure excellent signal integrity while reducing PCB footprint requirements. Available in SOP and BGA packages, 3D PLUS DDR2 SDRAM devices are designed for reliable surface-mount integration and robust operation in demanding thermal, mechanical, and space environments.

3D PLUS DDR3 SDRAM space memories provide a higher-speed, lower-power alternative to DDR2 SDRAM, delivering enhanced performance for demanding space applications. Available in 16 Gb to 24 Gb densities, these radiation-tolerant memories are offered in x16, x48, and x72 configurations with 1.35 V or 1.5 V power supplies. Integrated decoupling capacitors ensure superior signal integrity while reducing PCB area requirements. Packaged in a standard BGA format, 3D PLUS DDR3 SDRAM devices support reliable SMT assembly and are designed to withstand harsh thermal, mechanical, and radiation environments.

3D PLUS DDR4 SDRAM memories build on decades of expertise in space memory design and manufacturing, following the successful development of SRAM, SDRAM, DDR1, DDR2, and DDR3 solutions. Offering higher performance and lower power consumption than DDR3 SDRAM, DDR4 modules are available in 16 Gb to 64 Gb densities with x48, x72, and x80 configurations and a 1.2 V power supply. Featuring an optimized architecture with integrated decoupling capacitors and termination resistors, these radiation-tolerant memories ensure excellent signal integrity and efficient PCB integration. Packaged in BGA format, they are designed for reliable SMT assembly and robust operation in harsh thermal, mechanical, and space environments.

High-performance, radiation-tolerant SDRAM space memory solutions are designed to meet the stringent requirements of demanding space applications. Available in capacities from 512 Mb to 4 Gb, these memory stacks provide high-density storage and high-speed data transfer capabilities essential for space missions. Operating at 3.3 V, they offer flexible data bus configurations, including x8, x16, x32, x40, and x64, enabling efficient integration into a wide range of spaceborne system architectures.

Radiation-tolerant SRAM space memories provide high-speed and high-density data storage solutions for demanding space applications. Available in 4 Mb to 32 Mb capacities, they support x8, x16, x32, and x40 data bus configurations, with 12 ns access time for fast and efficient processing performance. Operating at 3.3 V or 5.0 V, these memories are designed for reliable operation in harsh space environments. Delivered in compact SOP packages, they enable robust SMT assembly while ensuring resistance to thermal and mechanical constraints. Since their introduction in 2000, 3D PLUS SRAM memories have been widely deployed as processor RAM in high-performance space computing systems, supporting science, deep-space, Earth observation, launcher, manned space, and navigation missions.

The Radiation Intelligent Memory Controller (RIMC) is a fully configurable DDR2/DDR3/DDR4 SDRAM controller IP core designed to enhance the radiation tolerance of 3D PLUS memory modules. Supporting data widths from 8 bits up to 144 bits, it integrates all standard DDR memory controller functions along with advanced radiation mitigation features, including Single Event Upset (SEU) correction and Single Event Functional Interrupt (SEFI) protection. The RIMC IP core also provides flexibility in system integration, allowing users to select embedded PHY IPs or develop their own custom PHY implementation to meet specific application requirements.

Radiation-tolerant NAND Flash memory solutions provide reliable, high-performance data storage for demanding space applications. Designed to withstand harsh radiation, thermal, and mechanical environments, these space-qualified memories ensure dependable operation for long-duration exploration and critical missions. Based on Single-Level Cell (SLC) NAND Flash technology, they support asynchronous and synchronous parallel interfaces with x8 and x16 data bus configurations. Available in robust SOP and BGA packages, these modules enable reliable SMT assembly while offering the durability required for challenging space conditions.

Designed for demanding space missions, 3D PLUS 3.3V NOR Flash stacks deliver high density, fast performance, and proven reliability. Available with x8 or x16 data bus widths and an asynchronous parallel interface, they offer zero bad blocks, excellent endurance, and long-term data retention. Rugged SMT-compatible SOP packaging ensures reliable operation in extreme thermal and mechanical environments.

Since 2008, 3D PLUS NOR Flash modules have been trusted for processor boot, Program ROM, and Solid State Data Recorders. With flight heritage on MSL, InSight, Mars 2020, and the Emirates Mars Mission (Hope Probe), they remain a dependable choice for critical space applications.

3D PLUS Radiation Tolerant Intelligent Memory Stack (RTIMS) Flash is a high-density, plug-and-play NAND Flash solution designed for reliable operation in radiation environments. Integrating SLC NAND Flash memories with an embedded Flash Memory Controller (FMC), it simplifies system design while ensuring high performance and robust data integrity. The SLC architecture provides immunity to latch-up, while the FMC protects against Single Event Upsets (SEUs) using Triple Modular Redundancy (TMR) or Error Detection and Correction (EDAC). Integrated current monitoring and power management also detect and mitigate high-current Single Event Functional Interrupt (SEFI) events, ensuring dependable performance in demanding space applications.

Advanced High-Density NAND Flash Memory solutions meet the growing demand for reliable, large-capacity storage in space systems. Using Triple-Level Cell (TLC) technology, these devices achieve higher density by storing three bits per cell, while advanced error correction and wear-levelling techniques enhance reliability and endurance. To overcome radiation challenges, the memories operate in programmed SLC (p-SLC) mode, improving radiation tolerance and durability. They provide strong Single-Event Latch-up (SEL) immunity with LET thresholds above 62.5 MeV·cm²/mg, withstand up to 30 krad(Si) TID, and support up to 60,000 program/erase cycles. Compliant with ONFI 4.2 and NV-DDR3 interfaces, they enable high-speed aerospace data storage.

The 3D PLUS 3DCO0849 COMBO module is a space-grade Configuration Memory Boot Manager designed for aerospace applications requiring reliable AMD XQR Versal™ FPGA booting. Integrating all required hardware resources into a single module, it provides a streamlined solution for configuration management. Equipped with 16 Gb radiation-tolerant NAND Flash, it stores multiple large FPGA configuration bit streams and embedded processor data. Supporting on-orbit reconfiguration, the module enables flexible updates for evolving mission requirements. Built to space-grade standards, the 3DCO0849 COMBO delivers robust performance, durability, and reliability for satellite systems and other mission-critical aerospace applications.

Inspired by the goddess of memory, MNEMOSYNE is a radiation-immune non-volatile memory solution based on advanced 22 nm STT-MRAM FDSOI technology. Developed through the EU-funded H2020 MNEMOSYNE project, this ASIC delivers high reliability, long-term supply assurance, and European manufacturing for demanding space applications. Stacked radiation-immune memory ASICs provide exceptional density, data retention, and endurance. Available with serial or parallel interfaces in robust SOP packages, MNEMOSYNE modules support reliable SMT assembly in harsh environments. Designed for next-generation aerospace systems, MNEMOSYNE enables secure FPGA configuration and processor boot/program storage, offering a dependable, high-performance memory solution for critical missions.

PROM (Programmable Read-Only Memory) is a One-Time Programmable (OTP) non-volatile memory technology designed for high-performance and high-reliability space computer systems. 3D PLUS PROM modules combine advanced memory cell technology with robust construction using epitaxial semiconductor substrates. Through the 3D PLUS stacking process, these memories achieve capacities up to 128 Mb in a compact SOP package. Designed for reliable Surface Mount Technology (SMT) assembly, they provide excellent resistance to harsh thermal and mechanical conditions encountered in space environments. With their durability and long-term data retention, 3D PLUS PROM solutions are well suited for critical aerospace applications requiring secure and dependable memory storage.

3D PLUS radiation-tolerant MRAM (Magneto Resistive Random Access Memory) provides high-reliability, non-volatile storage for demanding space applications. Using magnetic polarization to store data, MRAM offers inherent radiation immunity against Single Event Upsets (SEUs) while delivering SRAM-like speed, unlimited endurance, and long-term data retention. Based on Everspin technology, 3.3V MRAM stacks support x8, x16, x32, and x40 data bus widths. Packaged in rugged SOP formats for SMT assembly, they withstand extreme space environments. Since 2007, 3D PLUS MRAM has supported missions including Glonass, Sentinel-2, and KompSat-6, providing reliable solutions for processor booting, program storage, and FPGA bitstream configuration.

3D PLUS radiation-tolerant Point-Of-Load (PoL) DC/DC Converters provide compact, lightweight, and reliable power solutions for space applications. Supporting 4.5V to 13.2V input ranges, they deliver adjustable output voltage with high efficiency and fast transient response for ASICs, FPGAs, and memory devices. Integrated protections include overload, under-voltage, overheating, Soft Start, ON/OFF control, and Power Good monitoring. Built-in EMC filters simplify system integration while gull wing SMD packages ensure robust SMT assembly in harsh environments. Designed for distributed power architectures, these converters provide reliable power management for advanced digital electronics requiring high performance and radiation tolerance in space missions.

3D PLUS DDR2, DDR3, and DDR4 Termination Regulator (TR) modules provide compact, flexible, and reliable power solutions for low-voltage, low-noise DDR memory systems. Designed for high-performance DDR VTT bus applications, they offer fast transient response, remote sensing, and Command pin control. Incorporating radiation mitigation techniques and 3D PLUS space-qualified stacking technology, these Rad-Hard-by-Design modules ensure enhanced reliability in demanding space environments. Their compact, lightweight packaging simplifies integration while maintaining high performance and durability. Optimized for high-reliability applications, 3D PLUS TR modules deliver stable power management and improved DDR memory performance for advanced aerospace and space systems.

3D PLUS Radiation Tolerant Low Voltage Differential Signal (LVDS) line drivers and receivers integrate 4 or 8 LVDS channels in highly miniaturized packages, enabling significant area and weight savings for space system designs. Available in various temperature ranges with a single 3.3V power supply, these devices support high-performance digital electronics. Packaged in standard SOP footprints, 3D PLUS LVDS solutions ensure reliable SMT assembly and resistance to harsh thermal and mechanical environments. Designed for high-speed point-to-point interfaces, 3D PLUS LVDS products support a wide range of space applications, including science missions, deep space exploration, Earth observation, navigation, launch vehicles, and crewed spacecraft.

3D PLUS Radiation Hardened Low Voltage Technology (LVT) dual 16-bit transceivers and level shifters provide high-speed, low-power performance in highly miniaturized packages, maximizing space and weight savings for space applications. Supporting two-way asynchronous communication between buses, these devices feature cold sparing, bus hold functions, and configurable data direction control. Dual enable inputs allow device isolation and cold sparing, while enabling 32-bit operation when combined. Available in standard SOP footprints, they ensure reliable SMT assembly and durability in harsh environments. The LVT product line supports multiple supply voltages for high-reliability applications, including GEO missions, Earth observation, navigation, crewed spacecraft, and deep space exploration.

3D PLUS SERDES solutions provide high-speed, reliable serial data transmission for demanding space applications. Designed with space-qualified technology, these devices support data rates up to 1.428 Gbit/s with PLL frequency ranges from 20 to 68 MHz. Optimized for low power consumption, they include a power-down mode to improve energy efficiency. Requiring no external components, the SERDES simplifies system integration while reducing size and weight. Featuring rising clock edge triggering and a compact design, 3D PLUS SERDES solutions enable efficient, high-performance communication for advanced space systems where reliability, miniaturization, and low power consumption are essential.

Advanced semiconductor devices used in space applications require protection against Single Event Latch-Up (SEL), a radiation-induced effect that can cause destructive overcurrent conditions. The 3D PLUS 3DPM0168 Latch-Up Current Limiter (LCL) provides reliable protection by monitoring power supply lines and instantly disconnecting power during overcurrent or SEL events. Designed with radiation mitigation techniques and space derating rules, this Rad-Hard-by-Design, ITAR-free device offers SEL/SEE LETth of 80 MeV·cm²/mg and TID tolerance up to 50 krad(Si). Manufactured using 3D PLUS Space Qualified stacking technology, it combines high reliability, compact size, and low weight in a 20-pin SOP package.

The 3DPM0356-1 Switch module is designed for space applications to monitor and protect power supply lines by isolating failures and preventing propagation to downstream components. Supporting advanced digital systems such as FPGAs, it enables fast power shutdown to protect sensitive loads during overcurrent events. The adjustable current threshold, configured through an external resistor, provides flexible protection settings. System re-powering is controlled through external EN and OVP# digital inputs. Developed for high reliability and radiation tolerance, the module offers SEL/SET LETth of 62.5 MeV·cm²/mg and TID tolerance of 50 krad(Si), while maintaining a compact, lightweight design.

The 3D PLUS FUSIO RT family delivers reprogrammable Rad-Hard-By-Design (RHBD) SRAM-based FPGA solutions with integrated high-reliability memory resources. Each device combines a 128 Mbit Triple Modular Redundancy (TMR) configuration memory with optional computing and data storage memories in a single miniaturized package. Designed for demanding space applications, FUSIO RT products provide exceptional performance, high density, and robust reliability in radiation environments. These advanced FPGA solutions are ideal for mission-critical systems, including telecommunication satellites, experimental instruments, and other aerospace platforms requiring flexible reconfiguration, secure operation, and long-term durability in harsh space conditions.

The 3D PLUS 3DRC3508ES2861 is a radiation-mitigated, high-speed octal majority voter module designed to enhance reliability in mission-critical space applications. Featuring built-in Triple Modular Redundancy (TMR), it processes three 8-bit inputs and provides a voted output with an error signal identifying input discrepancies. Operating from 1.65V to 5.5V, the module supports flexible redundancy architectures through cold sparing functionality. Designed for immunity to Single Event Transients (SET) and Single Event Latch-up (SEL), and reduced sensitivity to SEU/MBU, it ensures robust operation in radiation environments. This ITAR-free, space-qualified solution improves digital system reliability and lifetime.