Fusio-II module

Key Features

1. Reduced footprint.
   By internally connecting the FPGA, the NAND flash and the mDDR, the Fusio-II module comes out
   with a reduced pin count of 484 balls compared with the original FGPA footprint of 676 balls.
   Considering the overall footprints of the memories, FPGA and decoupling capacitors, the Fusio-II does
   provide a footprint reduction from 937 mm2 down to 361mm2 (without mention of extra layout space
   for high speed signal integrity)
2. Optimized module size.
   Using its wafer stacking WDoD™ technology, 3D PLUS can embedded heterogeneous components
   without interposer or bonding and therefore achieve the lowest possible form factor in all three
   dimensions offering a module of only 19 x 19 x3.9mm.
3. Fast time to market thanks to a validated subsystem.
   As a fully tested and validated subsystem, the Fusio-II can be directly placed on a board and
   connected to dedicated peripherals, significantly reducing design and test development times paving
   the way to quick board derivatives.

Fusio-II main characteristics:

• Spartan®-6 XQ6SLX150T FPGA with high speed serial connectivity offering an integration of up to 147 443 logic cells.
• 4 High speed GTP serial transceivers characterized at 2.5Gbp/s, which can be configured as a PCI-express endpoint.
• 2x128Mbits of low power mDDR operating at 166 MHz.
• 167 decoupling caps providing optimum filtering for each 10 power supplies
• 203 multi-purpose User I/O through three independent banks

Manufacturer Info

• www.3d-plus.com

Downloads

• Press release