A System-In-Package (SiP) consists of a number of dissimilar integrated circuits enclosed in a single highly miniaturized package. The SiP performs all or most of the functions of an electronic system, and, it can contain several silicon components (bare die or package) and passive components.
3D PLUS provides a one-stop source for customer’s concept analysis, feasibility study, design, manufacturing and test of high reliability and high performance SiP.
Our State-of-the-Art stacking technology for SiP allow us to bring the best standard semiconductor devices and technology node in one single highly miniaturized package with almost no limit for the merging of heterogeneous technologies (die – package – passives).
Key Features
Technic
3D PLUS provides four different very flexible Stack Technology Flows that can be used for the design of various styles of SiPs:
Depending on the SiP performance requirements and targeted market, the relevant stacking process will be selected within 3D PLUS technology portfolio in order to bring the best added value and benefits for our customer designs.
Achieving a combination that cannot be realized with monolithic System-on-Chip (SoC) approaches, and, relying on a proven “first time right” design and development methodology, 3D PLUS SiP stacks are more effective and have also a lower development cost and a faster time to market.
Design Flow & Quality Assurance
START YOUR SiP DESIGN HERE
Summarize the following information to submit your custom SiP concept analysis and feasibility study:
