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More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer markets as smartphones, tablets and many handheld devices require advanced features in light and thin products. Currently, those requirements are being fulfilled by fan-in or package on package (PoP) technologies, but real 3D low-profile components are being introduced for specific applications.

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Space Tech Europe Expo 2026

Space Tech Europe Expo 2026

Space Tech Europe Expo 2026 Space Tech Expo Europe is Europe’s leading B2B trade fair for space technology, components, and services, held annually in Bremen. It serves as a central…
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