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More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer markets as smartphones, tablets and many handheld devices require advanced features in light and thin products. Currently, those requirements are being fulfilled by fan-in or package on package (PoP) technologies, but real 3D low-profile components are being introduced for specific applications.

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Space Tech Europe Expo - 2026

Space Tech Europe Expo 2026

MSA Components GmbH 13. March 2026
Space Tech Europe Expo 2026 Space Tech Expo Europe is Europe’s leading B2B trade fair for space technology, components, and services, held annually in Bremen. It serves as a central…
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Space Power Conference – ESPC 2026

Space Power Conference – ESPC 2026

MSA Components GmbH 13. March 2026
Space Power Conference – ESPC 2026 The ESA European Space Power Conference (ESPC) is a key international forum organized by the European Space Agency that focuses on electrical power supply…
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MSA Components GmbH
Am Glockenberg 13
57439 Attendorn
Germany
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Call us: +49 (0) 27 22 63 73 0 Mail us: info@msa-components.com