The 3DCM734/3DCM739 embeds a high-resolution CMOS image sensor (monochrome : P/N 3DCM734, RGB: P/N 3DCM739), offering multiples readout features (sub-sampling, ROI, multi-parameters). It embeds an FPGA-based electronic architecture based on a flash-based FPGA associated with its volatile and non volatile memories. This allows for an efficient control of the sensor, as well as processing capacities for image pre-processing and formatting, making the 3DCM734/3DCM739 suitable for a large range of applications.
The 3DCM734/3DCM739 electrical interface offers multiple LVDS User IOs, compatible with standard SpaceWire communication interface, for an easy integration into complex systems requiring high-speed and flexible data and image transmission. It also offers standard I/Os allowing control of external components or instruments. All needed power supplies are embedded in the camera module, which only requires a 5V input.
The 3DCM734/3DCM739 CMOS Camera Head is based on 3D PLUS stacking technology, which is qualified for harsh environment, withstanding appreciable mechanical shock and vibrations, and 3D PLUS experience in space design and components choice, allowing for a high reliability and high density Camera Head.
The 4 Mpx CMOS Space Camera Head is a high-density and high-resolution CMOS Camera Head for space applications.
SPACE TECH EXPO EUROPE 2026
Discuss your project in person with our sales team, from component selection to design-in. We will set aside 30 minutes for you.
SPACE TECH EXPO EUROPE
Besprechen Sie Ihr Projekt persönlich mit unserem Vertriebsteam, von Bauteilauswahl bis Design-in. Wir nehmen uns 30 Minuten Zeit.