CASPEX Space Camera Head - 4M (3DCM734 / 3DCM739)

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User-reconfigurable FPGA-Based Architecture

  • Flash-based FPGA
  • 1Gb DDR3 and 8Gb NAND Flash memories
  • LVDS 2v5, GPIO 3v3, JTAG
  • Operating average power consumption : 1.5 W @25°C

More features

  • One single 5V input power supply needed
  • Integrated temperature sensor
  • Optimized Thermal interface
  • TID 30 krads / SEL immune up to LET > 60 MeV.cm2/mg
  • Temperature Range: -40°C to +70°C
  • Ultra-miniaturized CMOS Camera Head (35x35x23 mm, weight : 64g) with PGA package

4 Mpixels CMOS global shutter image sensor

  • 2048 (H) x 2048 (V) active pixels (5.5 μm)
  • Read noise : 13e-, Dark current : 125 e-/s at 25°C, Full Well Capacity > 13.5ke
  • Spectral Response: 400-1000 nm, QE x FF : 60% @550 nm with microlenses
  • Multiple modes (Readout, subsampling, ROI), 10/12 bits modes
  • Maximum framerate : 16/7 frame/s in 10/12 bit in all-pixel scan mode (@ sensor interface)

Description

The 4 Mpx CMOS Space Camera Head is a high-density and high-resolution CMOS Camera Head for space applications.

Applications

  • Earth Observation
  • Planetary Science
  • Platform Monitoring
  • Navigation & Docking, Rendezvous, Star tracking

More information

Downloads

Manufacturer Info

CASPEX Space Camera Head - 4M (3DCM734 / 3DCM739)

Category: Brand:

The 4 Mpx CMOS Space Camera Head is a high-density and high-resolution CMOS Camera Head for space applications.

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The 3DCM734/3DCM739 embeds a high-resolution CMOS image sensor (monochrome : P/N 3DCM734, RGB: P/N 3DCM739), offering multiples readout features (sub-sampling, ROI, multi-parameters). It embeds an FPGA-based electronic architecture based on a flash-based FPGA associated with its volatile and non volatile memories. This allows for an efficient control of the sensor, as well as processing capacities for image pre-processing and formatting, making the 3DCM734/3DCM739 suitable for a large range of applications.

The 3DCM734/3DCM739 electrical interface offers multiple LVDS User IOs, compatible with standard SpaceWire communication interface, for an easy integration into complex systems requiring high-speed and flexible data and image transmission. It also offers standard I/Os allowing control of external components or instruments. All needed power supplies are embedded in the camera module, which only requires a 5V input.

The 3DCM734/3DCM739 CMOS Camera Head is based on 3D PLUS stacking technology, which is qualified for harsh environment, withstanding appreciable mechanical shock and vibrations, and 3D PLUS experience in space design and components choice, allowing for a high reliability and high density Camera Head.

User-reconfigurable FPGA-Based Architecture

  • Flash-based FPGA
  • 1Gb DDR3 and 8Gb NAND Flash memories
  • LVDS 2v5, GPIO 3v3, JTAG
  • Operating average power consumption : 1.5 W @25°C

More features

  • One single 5V input power supply needed
  • Integrated temperature sensor
  • Optimized Thermal interface
  • TID 30 krads / SEL immune up to LET > 60 MeV.cm2/mg
  • Temperature Range: -40°C to +70°C
  • Ultra-miniaturized CMOS Camera Head (35x35x23 mm, weight : 64g) with PGA package

4 Mpixels CMOS global shutter image sensor

  • 2048 (H) x 2048 (V) active pixels (5.5 μm)
  • Read noise : 13e-, Dark current : 125 e-/s at 25°C, Full Well Capacity > 13.5ke
  • Spectral Response: 400-1000 nm, QE x FF : 60% @550 nm with microlenses
  • Multiple modes (Readout, subsampling, ROI), 10/12 bits modes
  • Maximum framerate : 16/7 frame/s in 10/12 bit in all-pixel scan mode (@ sensor interface)

Description

The 4 Mpx CMOS Space Camera Head is a high-density and high-resolution CMOS Camera Head for space applications.

Applications

  • Earth Observation
  • Planetary Science
  • Platform Monitoring
  • Navigation & Docking, Rendezvous, Star tracking

More information

Downloads

Manufacturer Info

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MSA Components GmbH
Am Glockenberg 13
57439 Attendorn
Germany
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