COMBO [COnfiguration Memory BOot manage] (3DMCO0849)

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Module Configuration

  • Power Supply: 1.2V, 2.5V, 3.3V
  • Temperature Range: -40°C to +105°C
  • High level of miniaturization : 32 x 32 mm² area, 22 g

Interfaces
For user ground support to store bitstreams and configuration files:

  • UART Interface:
    • Baudrate: 115 200 bps
  • SPI Ground Support interface:
    • Bandwidth : up to 264 Mbps (Octal)

For in-flight use to boot SRAM FPGAs and MPSoCs:

  • SPI Boot interface:
    • Bandwidth : up to 264 Mbps (Dual Quad)
  • SelectMap Interface
    • Bandwidth : up to 264 Mbps (8 bits)

For in-flight use to Read and Write bitstreams/files

  • SPI R&W interface:
    • Bandwidth : up to 264 Mbps (Octal)

Radiation performances
 TID > 50 krad (Si)
 SEL LET > 62.5 MeV.cm²/mg

Description

The 3DCO0849 COMBO is a space grade configuration memory boot manager to configure SRAM based FPGAs requiring a large configuration memory.

More information

Downloads

Manufacturer Info

COMBO [COnfiguration Memory BOot manage] (3DMCO0849)

Categories: , Brand:

The 3DCO0849 COMBO is a space grade configuration memory boot manager to configure SRAM based FPGAs requiring a large configuration memory.

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3D PLUS’s COMBO module provides a unique solution that combines all required hardware resources into a single module to boot the SRAM based FPGA and does so in the smallest PCB footprint available in the market. COMBO is an all-in one smart space grade solution performing the following functions:

  • 16Gb Storing capability of multiple bitstreams and OS images for the FPGAs and their embedded processors.
  • Booting the SRAM based FPGA and MPSoCs from the required configuration image stored in the NAND Flash.
  • Supporting functionalities to provide data integrity for the stored bitstreams.
  • Providing the multiple bitstreams management.
  • Providing file protection for golden bitstream.
  • Allowing the in-flight reconfiguration of the bitstream.
  • Allowing persistent file storage if needed.
  • Supporting different SRAM FPGA types:
    • Versal ACAP,
    • Ultrascale / Ultrascale+,
    • 7 Series, 6 Series, 5 Series,
    • NG-Ultra...

Module Configuration

  • Power Supply: 1.2V, 2.5V, 3.3V
  • Temperature Range: -40°C to +105°C
  • High level of miniaturization : 32 x 32 mm² area, 22 g

Interfaces
For user ground support to store bitstreams and configuration files:

  • UART Interface:
    • Baudrate: 115 200 bps
  • SPI Ground Support interface:
    • Bandwidth : up to 264 Mbps (Octal)

For in-flight use to boot SRAM FPGAs and MPSoCs:

  • SPI Boot interface:
    • Bandwidth : up to 264 Mbps (Dual Quad)
  • SelectMap Interface
    • Bandwidth : up to 264 Mbps (8 bits)

For in-flight use to Read and Write bitstreams/files

  • SPI R&W interface:
    • Bandwidth : up to 264 Mbps (Octal)

Radiation performances
 TID > 50 krad (Si)
 SEL LET > 62.5 MeV.cm²/mg

Description

The 3DCO0849 COMBO is a space grade configuration memory boot manager to configure SRAM based FPGAs requiring a large configuration memory.

More information

Downloads

Manufacturer Info

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MSA Components GmbH
Am Glockenberg 13
57439 Attendorn
Germany
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