The 3D PLUS De-Facto Ecosystem: Radiation-Tolerant Microelectronics for Space and Defense
3D PLUS delivers not just standalone components, but a cohesive suite of interoperable solutions – memory modules, computing units, power converters, and interfaces – all designed to work seamlessly together under extreme conditions. While the company doesn’t formally brand this as an "ecosystem," the cross-compatibility of its products, exemplified by its officially branded DDR4 Ecosystem for radiation-tolerant memory, creates a de-facto plug-and-play platform for space and defense applications.
Radiation-tolerant electronics are essential for ensuring the reliability of systems in demanding space and defense applications. The French company 3D PLUS, part of the HEICO Corporation, has been developing miniaturized microelectronic solutions for years, specifically designed to operate under extreme environmental conditions. Its so-called ecosystem includes memory modules, computing units, power converters, and interface components – all from a single source, with a strong focus on international space-grade qualifications, miniaturization, and long-term reliability.
This article provides a detailed overview of the technological features, application areas, and strategic importance of the 3D PLUS product portfolio. Special emphasis is placed on the De-Facto ecosystem's role as a modular technology platform for current and future space and defense projects.
Challenging Conditions in Space and Defense Environments
Electronic components used in space are exposed to high-energy radiation, which can cause single event effects (SEE), total ionizing dose (TID), and other failure mechanisms. Additional factors include extreme temperature variations, vibration, and the need for long-term functionality without maintenance. Designing and qualifying systems for these challenges requires the highest standards in development and production.
In defense applications, electronics must also function reliably under harsh conditions – for example, in unmanned aerial vehicles, missile systems, or mobile ground equipment. In addition to robustness, requirements include energy efficiency, compact design, and electromagnetic compatibility. 3D PLUS addresses these needs with an De-facto ecosystem based on components qualified to standards such as ESCC, MIL-PRF-38534, and NASA EEE-INST-002.
The ability to ensure system availability under such adverse conditions is not only a technical necessity but also a strategic enabler. Whether in Earth observation satellites, deep space exploration, or defense-grade command systems – radiation tolerance is a non-negotiable foundation for mission success.
3D PLUS’s Modular Building Blocks: A Technical Overview
The interoperable 3D PLUS component portfolio comprises five core product categories that can be flexibly combined or adapted to specific mission requirements. Central to this de-facto ecosystem approach is 3D PLUS's proprietary packaging technology, enabling vertical integration of active, passive, and optoelectronic elements into highly compact modules. This methodology delivers exceptional reliability and performance while optimizing space and weight - critical benefits for satellite and aerospace applications.
1. Memory Modules
3D PLUS provides a wide range of radiation-tolerant memory modules, including SDRAM, DDR1/2, SRAM, DPRAM, EEPROM, and FLASH (NOR and NAND). These modules feature high density, low power consumption, and robust radiation tolerance. Thanks to 3D stacking, several memory chips can be combined in a single hermetically sealed package.
Application Potential: Missions such as EarthCARE and MetOp-SG exemplify the demand for robust memory solutions – like those offered by 3D PLUS – for data logging, storage, and buffering tasks in orbit. These memories are also critical in avionics systems, autonomous navigation modules, and payload controllers where radiation-induced errors must be prevented.
2. Computer Modules
Built on processor architectures such as LEON, PowerPC, and ARM, 3D PLUS offers high-performance computing modules with integrated memory and interfaces. These modules support communication standards like SpaceWire, CAN, and MIL-STD-1553 and are suited for onboard data handling, mission control, and real-time processing.
These computing blocks are used in payload management units, spacecraft navigation, and sensor fusion systems. The modular approach allows integrators to select the right performance tier while benefiting from radiation-tolerant packaging and proven qualification pathways.
3. Power Management Modules
The company's DC/DC converters are optimized for input voltages up to 50 V and deliver stable output even under extreme environmental stress. They feature SEE protection, latch-up immunity, and excellent power efficiency – ideal for energy-constrained satellite systems.
In defense programs, power management modules are used in mobile command posts, electronic warfare systems, and missile guidance electronics where robustness and energy efficiency are vital. Temperature cycling, vibration resistance, and noise immunity make these modules suitable for deployment in rugged environments.
4. FUSIO RT: Radiation-Tolerant FPGA Platform
FUSIO RT is a fully in-house developed FPGA family offering reconfigurable logic tailored for critical space systems. Built on 130 nm CMOS technology, it provides up to 1M logic elements and supports in-orbit reconfiguration. Triple Modular Redundancy (TMR) is built-in to enhance reliability in radiation-heavy environments.
In Practice: A FUSIO RT FPGA was successfully deployed during China’s Chang’e-6 mission – the first in-orbit use under real conditions.
These FPGAs are well-suited for artificial intelligence acceleration, autonomous decision-making, and communication protocol handling in orbit. The ability to update logic structures post-launch provides flexibility for mission adaptation and fault recovery.
5. Interfaces and Interconnects
In addition to core components, 3D PLUS offers interface and interconnect solutions, including SpaceWire transceivers and optoelectronic links. These parts are compact, shielded, and tailored for seamless integration in modern space subsystems.
These components play a critical role in managing data exchange between spacecraft subsystems and in enabling redundancy paths. Low mass and EMI resistance are vital for distributed avionics architectures.
Technology Platform: 3D Packaging
3D PLUS’s proprietary stacking technology allows for vertical integration of various chip types (digital, analog, passive, optoelectronic) into one compact unit. The resulting modules offer up to 80% space savings compared to traditional designs, with improved signal integrity and EMI performance. Packaging solutions are optimized for thermal stability, shock resistance, and mechanical strength.
The process includes wire bonding, microvia interconnection, and low-outgassing encapsulation – fully compliant with space environmental requirements. Qualification can be performed to ECSS and MIL standards.
Application Scenarios in Space and Defense
3D PLUS's de-facto ecosystem approach is used globally in a wide range of space and defense programs. In the space domain, applications include scientific missions, Earth observation, navigation satellites, launchers, and large-scale LEO/MEO constellations. Example use cases include onboard computers, data processors, memory units, and subsystem interfaces.
In defense, 3D PLUS’s interoperable components are found in missile systems, UAV platforms, battlefield control systems, and mobile communications hardware. Their resistance to shock, vibration, and electromagnetic interference makes them suitable for harsh terrestrial and naval environments as well.
Typical scenarios include radiation-tolerant controllers in smart munitions, secure communication nodes in electronic warfare, and sensor processing units in airborne ISR platforms.
Strategic Value for Current and Future Programs
With the industry-wide shift toward modularization and miniaturization, the demand for high-integration, low-power, and robust systems is increasing. 3D PLUS’s interoperable component portfolio supports this development by offering compact, configurable, and qualified building blocks. Customers can assemble complete systems using standardized modules or request tailored adaptations.
Looking ahead, reconfigurable onboard computing and AI-capable hardware will play a central role in future missions. The ability to update or reprogram logic devices in orbit is becoming a standard requirement. 3D PLUS actively addresses this trend with its FUSIO RT platform, part of its de-facto ecosystem approach.
By combining scalable product lines with rigorous quality and heritage, 3D PLUS enables faster development cycles and reduces the risk for mission-critical applications. The company’s strong position in both New Space and institutional space programs demonstrates the versatility of its cross-compatible solutions.
Organizations seeking long-term, qualified microelectronics for space or defense missions benefit from 3D PLUS’s proven, adaptable component portfolio – a de-facto standard for harsh-environment applications.
If you would like to explore how 3D PLUS components can be integrated into your system architecture, our team will be happy to assist you. Just submit your inquiry via this link or arrange a no-obligation consultation.
