6 Gbit DDR2 SDRAM (3D2D6G48UB3687)

• Organized as 128M × 48.
• Supply voltage: 1.8 V ± 0.1 V.
• JEDEC standard 1.8 V I/O (SSTL_18 compatible).
• Maximum data rate: 333 MHz.
• Differential data strobe per byte.
• 4n-bit prefetch architecture.
• DLL to align DQ and DQS transitions with CK.
• 6 internal banks per die for concurrent operation.
• Programmable CAS Latency.
• Posted CAS Additive Latency.
• Write Latency = Read Latency − 1 tCK.
• Programmable Burst Lengths:
  • 4
  • 8
• On-Die Termination (ODT).
• Available temperature range:
  • 0°C to +70°C
  • -40°C to +85°C
  • Specific temperature range available upon request.
• Available with screening option for high reliability applications (Space, etc.).
• 3D PLUS DDR2 Radiation Hardened Solution:
  • TID > 100 Krad (Si).
  • SEL immune > 68 MeV·cm²/mg.
  • SEU immune by design (3.8E-9 upsets/SEU/day/module with 3DIPMC700).
  • SEFI immune by design (with 3DIPMC700).

Beschreibung

The 3D2D6G48UB3687 is a high-speed highly integrat­ed DDR2 Synchronous Dynamic Ram Memory.

Downloads

• 3D Plus Memory Module P/N Decoder

Manufacturer Info

• www.3d-plus.com