The 3DCM830 embeds a SWIR InGaAs image sensor, offering multiples integrated readout features (sub-sampling, ROI, multiparameters). The 3DCM830 also embeds a high performance electronic architecture based on a reconfigurable FPGA associated with its TMR configuration memories, as well as volatile and non volatile memories. This allows for an efficient control of the sensor, as well as processing capacities for image pre-processing and formatting, making the 3DCM830 suitable for a large range of applications.
The 3DCM830 electrical interface offers multiple LVDS User IOs, usable for interfaces such as CameraLink or SpaceWire, for an easy integration into complex systems requiring highspeed and flexible data and image transmission. All needed power supplies are embedded in the 3DCM830, which only requires a 5V input.
The 3DCM830 SWIR Camera Head is based on 3D PLUS stacking technology, which is qualified for harsh environment, withstanding appreciable mechanical shock and vibrations, and 3D PLUS experience in space design and components choice, allowing for a high reliability and high density Camera Head.