CASPEX Space Camera Head - 1.3 SWIR (3DCM800 / 3DCM828)

Category:

User-reconfigurable FPGA-Based Architecture

  • High-end FPGA (500K System Logic Cells)
  • 8Gb DDR3 and 48Gb NAND Flash memories
  • TMR SPI NOR configuration memory
  • LVDS, GPIO, JTAG
  • Maximum power consumption < 8 W

More features

  • One single 5V input power supply needed
  • Integrated temperature sensors
  • Dedicated Thermal/Mechanical interfaces
  • TID 40 krads / SEL immune up to LET > 60 MeV.cm2/mg
  • Operating Temperature Range: -40°C to +70°C
  • Ultra-miniaturized SWIR CMOS Camera Head (40x40x44 mm, weight <125g) with PGA package

1.31 Mpixels SWIR global shutter InGaAs image sensor

  • 1280 (H) x 1024 (V) square active pixel array
  • Visible + SWIR Spectral Response: 0.4 - 1.7 μm
  • Read noise : 240e-, Full Well Capacity > 170ke-
  • Multiple modes (All-pixel scan, Readout, subsampling, ROI), 8/10/12 bits modes
  • 134/125/71 frame/s in 8/10/12 bit in all-pixel scan
  • mode

  • Up to 3270 frame/s for smaller ROI mode

Description

The 3DCM830 SWIR Space Camera Head is a high-density, high-performance, high-resolution SWIR Camera Head for space applications.

Applications

  • Source tracking (Satellite to Satellite IR communications)
  • Earth observation, Atmosphere Monitoring,
  • Spectrometry
  • Star tracking

More information

Downloads

Manufacturer Info

CASPEX Space Camera Head - 1.3 SWIR (3DCM800 / 3DCM828)

Category:

The 3DCM830 SWIR Space Camera Head is a high-density, high-performance, high-resolution SWIR Camera Head for space applications.

» Do you need more details about this product?

The 3DCM830 embeds a SWIR InGaAs image sensor, offering multiples integrated readout features (sub-sampling, ROI, multiparameters). The 3DCM830 also embeds a high performance electronic architecture based on a reconfigurable FPGA associated with its TMR configuration memories, as well as volatile and non volatile memories. This allows for an efficient control of the sensor, as well as processing capacities for image pre-processing and formatting, making the 3DCM830 suitable for a large range of applications.

The 3DCM830 electrical interface offers multiple LVDS User IOs, usable for interfaces such as CameraLink or SpaceWire, for an easy integration into complex systems requiring highspeed and flexible data and image transmission. All needed power supplies are embedded in the 3DCM830, which only requires a 5V input.

The 3DCM830 SWIR Camera Head is based on 3D PLUS stacking technology, which is qualified for harsh environment, withstanding appreciable mechanical shock and vibrations, and 3D PLUS experience in space design and components choice, allowing for a high reliability and high density Camera Head.

User-reconfigurable FPGA-Based Architecture

  • High-end FPGA (500K System Logic Cells)
  • 8Gb DDR3 and 48Gb NAND Flash memories
  • TMR SPI NOR configuration memory
  • LVDS, GPIO, JTAG
  • Maximum power consumption < 8 W

More features

  • One single 5V input power supply needed
  • Integrated temperature sensors
  • Dedicated Thermal/Mechanical interfaces
  • TID 40 krads / SEL immune up to LET > 60 MeV.cm2/mg
  • Operating Temperature Range: -40°C to +70°C
  • Ultra-miniaturized SWIR CMOS Camera Head (40x40x44 mm, weight <125g) with PGA package

1.31 Mpixels SWIR global shutter InGaAs image sensor

  • 1280 (H) x 1024 (V) square active pixel array
  • Visible + SWIR Spectral Response: 0.4 - 1.7 μm
  • Read noise : 240e-, Full Well Capacity > 170ke-
  • Multiple modes (All-pixel scan, Readout, subsampling, ROI), 8/10/12 bits modes
  • 134/125/71 frame/s in 8/10/12 bit in all-pixel scan
  • mode

  • Up to 3270 frame/s for smaller ROI mode

Description

The 3DCM830 SWIR Space Camera Head is a high-density, high-performance, high-resolution SWIR Camera Head for space applications.

Applications

  • Source tracking (Satellite to Satellite IR communications)
  • Earth observation, Atmosphere Monitoring,
  • Spectrometry
  • Star tracking

More information

Downloads

Manufacturer Info

Back to Top
MSA Components GmbH
Am Glockenberg 13
57439 Attendorn
Germany
MAIL US
menu
linkedin facebook pinterest youtube rss twitter instagram facebook-blank rss-blank linkedin-blank pinterest youtube twitter instagram