The 3DCM800 embeds a high-resolution 1.1” CMOS image sensor, offering multiple readout features (subsampling, Region-Of-Interest...) available in monochrome (3DCM800) or RGB (3DCM828). It embeds a high-performance FPGA-based electronic architecture associated with its TMR configuration memories, as well as volatile and non-volatile memories. This allows for an efficient control of the sensor, as well as processing capabilities for image pre-processing and formatting, making both camera heads suitable for a large range of applications.
The electrical interface offers LVDS User IOs, usable for interfaces such as Camera Link or SpaceWire, for an easy integration into complex systems requiring high-speed and flexible data and image transmission. All needed power supplies are embedded, the camera head only requires a 5V input.
This camera head is based on 3D PLUS stacking technology, which is qualified for harsh environment, withstanding mechanical shocks and vibrations, and 3D PLUS large experience in space designs and components selection, allowing for a high reliability and high-performance camera head.
