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32 Gbit NAND Flash – based on 2 x (2G x 8) (3DFN32G08US2845)

SKU: a7244f51975a Categories: , , Brand:

The 3DFN16G08VS2705 is a high-density non-volatile NANO Flash memory is organized as 2G x 8. Each device of the module is a 8 Gbit NANO Flash organized as 1G x 8 bits, that can be accessed by activating the associated control signals: #CEn, #WEn, #REn, #RBn (n = 0, 1).

Using high performance and high reliability CMOS technology combined with 3D PLUS patented stacking technology, this FLASH memory module provides an area efficient solution for high capacity data storage needs.

Fabio Asti

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Fabio Asti
Business Developement Manager
+39 342 198 3878 fabio.asti@steliau.it
  • ONFI 2.1 compliant
  • Memory Cell Array: 2 × (2G × 8 bits)
  • Automatic Program and Erase

    • Page size × 8 bit: (4K + 224) Byte/Bank
    • Block Size: (512K + 28K) Byte/Bank
    • Module size: 8192 blocks
  • 1.8 V for I/O and 3.3 V for core
  • Synchronous I/O performance:

    • 10 MHz < f < 83.33 MHz
    • Read/write throughput per pin up to 166 MT/s
  • Command/Address/Data Multiplexed I/O Port
  • Hardware Data Protection (Program/Erase Lockout during Power Transitions)
  • Endurance: 100k Program/Erase Cycles with ECC
  • Data Retention: 10 Years
  • Available in all 3D PLUS screening and qualification options: commercial (C), industrial (I), and space (S)

Radtiation Tolerance

  • TID > 60 krad
  • SEL immune up to LET > 62.5 MeV·cm²/mg

Description

3DFN32G08US2845 modules provide a fully qualified memory solution. Packaged in SOP 54, they are available in Commercial, Industrial or Military temperature ranges and in all quality level

Applications

  • Telecommunication
  • Navigation
  • Science and Earth observation

Space Qualification

  • Qualified with 3D PLUS ESA certification per ESCC 2566001
  • Up to NASA Level 1
  • Long Term Availability and High Reliability
  • Radiation Hardened Design for High-End Space Computing Applications
  • Flight heritage: 3D PLUS expertise in space memories for more than 20 years (*)

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