The 3D3D16G72WB2768 is a highly integrated module operating as a DDR3 SDRAM 72b SO-DIMM in a BGA package. It is intended for use as main memory when installed in embedded systems.
It offers a memory density of 16Gbits with ECC on a 72 bits data bus in a single rank of 256Mbx72 high speed memory array. It is based on 5 dies achieving high speed double-data-rate transfer rates of up to 1333 Mb/sec/pin for general applications. The module is designed to comply with the following key DDR3 SO-DIMM features: (1) posted CAS with additive latency, (2) write latency = read latency -1, (3) On Die Termination (4) programmable driver strength data, (5) seamless BL4 access.
All the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and DQS#) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a RAS# and CAS# multiplexing style.
The 16Gb DDR3 device operates with a single power supply: 1.5V VDD (or 1.35V in DDR3L mode).
This device is ideal for high density memory applications that require high speed transfer and compatibility with standard processors, DSP or FPGAs.
Applications:
