• Based on Microspire’s « SESI22 Planar Technology »
• Low-profile SMD package (2 x 4 pins)
• Applied standards : MIL-STD-202, ECSS-Q-70-02, DO-160D
• Up to 25 W at 100 kHz in standard heating conditions
• Dielectric strength up to 1500 V ( 50 Hz – 1 min )
• Materials meet UL94-V0 rating
• Thermal index according to IEC85 : H ( 180 °C )
• Operating/storage temperature range : – 55 °C to + 125 °C
• Approx weight : 26 grams
