Higher-resolution optical payloads generate larger images and more data that must be stored onboard a spacecraft. In our Space Tech Expo Europe 2025 interview, Wissam Mouallem, Sales Director at 3D PLUS, identifies this trend as a driver behind a new generation of NAND Flash modules with nominal capacities of 4 and 8 Tbit. Unlike the DDR4 introduced in our previous interview, the focus here is non-volatile mass storage for payload data.
3D PLUS lists two high-density devices, 3DFN4T16LB1862 and 3DFN8T16LB2821. Their nominal 4 and 8 Tbit densities refer to the underlying triple-level cell (TLC) technology. For space applications, the manufacturer describes operation in programmed single-level cell (p-SLC) mode. In that mode, usable capacities decrease to approximately 1.33 and 2.67 Tbit, respectively. The trade-off is improved endurance and radiation tolerance compared with conventional TLC operation.
For payload recorder design, this distinction matters. Engineers must size the storage system for the selected operating mode, the expected image volume, sustained write load and integrity requirements, rather than for the nominal TLC density alone.
The modules use BGA-215 packaging and support ONFI 4.2 with an NV-DDR3 interface operating at up to 600 MHz. 3D PLUS specifies up to 60,000 program/erase cycles in p-SLC mode. The manufacturer’s published radiation figures include total ionising dose (TID) above 25 krad(Si) and a single-event latch-up (SEL) threshold above 62.5 MeV·cm²/mg.
These are manufacturer specifications associated with the stated product family and operating conditions. System designers still need to verify error correction, bad-block management, retention, temperature limits and the selected screening or qualification grade against the applicable documentation. The devices are memory components, not complete payload recorders.
Further details are available in the 3D PLUS product overview and the MSA portfolio. Availability and the required qualification level should be confirmed for the specific project.
3D PLUS will be a co-exhibitor in Hall 5, Booth F11 at Space Tech Expo Europe in Bremen, 17–19 November 2026. Visit the 3D PLUS team to discuss storage architectures for imaging payloads. Our extended team, including colleagues from MSA Components and Hi-Rel Solutions by Steliau Technology, will also be available for technical and project-related questions.
Arrange a technical discussion with our team in Bremen:
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