3D PLUS COMBO: Boot Management and FPGA Reconfiguration for Space Applications

In modern FPGA-based spacecraft systems, storing configuration data is only part of the challenge. Managing multiple bitstreams and the option to reconfigure an FPGA in orbit place additional demands on the memory and boot architecture.

This is where COMBO from 3D PLUS comes in. In our interview at Space Tech Expo Europe 2025, Wissam Mouallem, Sales Director at 3D PLUS, explains the requirements of modern FPGA generations and how the Configuration Memory Boot Manager addresses them.

Configuration and Boot Management in One Module

COMBO brings together the hardware resources required to boot SRAM-based FPGAs in a compact module. Designed in particular for the AMD XQR Versal family, the Configuration Memory Boot Manager makes FPGA configuration images available from integrated non-volatile storage.

Beyond initial boot, COMBO supports the management of multiple configuration images and provides functions to help maintain their data integrity. Different FPGA configurations can therefore be stored and, when required by the mission architecture, loaded during operation in orbit.

16 Gb of RT NAND Flash for Multiple Configuration Images

With its integrated 16 Gb of radiation-tolerant NAND Flash, COMBO offers storage for multiple large FPGA configuration bitstreams. The original 3D PLUS product announcement also describes storage for embedded-processor operating-system images and persistent files.

For mission architectures that maintain multiple configuration images, protection of a golden bitstream is another relevant feature listed by 3D PLUS. The actual number of images that can be stored depends on the size of the individual configuration files.

Package and Radiation Characteristics for Space Applications

COMBO uses a 483-ball BGA with a pitch of 1.27 mm. The module occupies 32 × 32 mm and weighs 22 g. 3D PLUS specifies an operating-temperature range of −40 to +105 °C and supply voltages of 1.2 V, 2.5 V and 3.3 V.

For radiation assessment, the manufacturer specifies total ionizing dose (TID) greater than 50 krad(Si) and a single-event latch-up (SEL) LET threshold greater than 62.5 MeV·cm²/mg. These parameters inform component selection and integration for the intended mission environment.

Another Perspective: MNEMOSYNE and Non-Volatile FPGA Memory

COMBO focuses on boot management and the handling of FPGA configuration images. With MNEMOSYNE, 3D PLUS addresses another part of the FPGA system architecture: non-volatile memory devices based on radiation-hardened STT-MRAM technology. In a separate interview, Wissam Mouallem discusses this memory family and its applications for FPGA configuration data in space.

This technical discussion follows our published interview with 3D PLUS CEO Pierre-Eric Berthet on the company’s broader technology developments.

Meet 3D PLUS at Space Tech Expo Europe 2026

Visit our co-exhibitor 3D PLUS at Space Tech Expo Europe in Bremen, 17–19 November 2026, Hall 5, Booth F11. Meet the 3D PLUS specialists to discuss COMBO, FPGA boot architectures and configuration memory for space applications.

Colleagues from MSA Components and Hi-Rel Solutions by Steliau Technology will also be there as our extended team for technical questions and project discussions.

Arrange a technical discussion with our team in Bremen: