Miniaturized High-Performance Modules from 3D PLUS: Radiation-Tolerant Technology for Aerospace and Defense (Part 1)

Reliable electronics is a prerequisite for demanding aerospace and defense applications. The French company 3D PLUS, a member of the HEICO Group, develops highly integrated, miniaturized electronic modules and system-in-package (SiP) solutions specifically designed for extreme environmental conditions. The 3D PLUS portfolio includes memory solutions, computing units, interface modules, imaging systems, as well as protection and power supply components—with a focus on international aerospace standards, miniaturization, and utmost reliability.

Thanks to its proprietary 3D packaging technology, active, passive, and optoelectronic components can be integrated into compact, high-performance modules. This enables flexible and adaptable solutions for mission-critical applications in aerospace and military systems.

Electronics for Extreme Conditions: Challenges and Requirements

Electronic components in aerospace applications are exposed to high-energy particle radiation, which can lead to Single Event Effects (SEE), Total Ionizing Dose (TID), and other failure mechanisms. Additional challenges include extreme temperature fluctuations, mechanical vibrations, and the need for long-term, maintenance-free operation.

In defense technology, highly reliable modules are also required to operate in unmanned aerial vehicles, missiles, or mobile ground stations. Here, besides robustness, energy efficiency, size optimization, and electromagnetic compatibility play a central role. 3D PLUS offers specialized solutions qualified according to international standards, including ESCC, MIL-PRF-38534, and NASA EEE-INST-002.

Product Portfolio: Highly Reliable SiP Solutions for Aerospace and Defense Systems

The product portfolio of 3D PLUS covers a wide range of applications and is based on miniaturized electronic modules that can be deployed in demanding environments. Integration is achieved using in-house 3D packaging technology, ensuring maximum packing density, EMC performance, and thermal stability.

1. Memory Solutions

3D PLUS offers a comprehensive portfolio of radiation-tolerant memory solutions, divided into two main technology domains: volatile memories for temporary data processing, and non-volatile memories for permanent data storage. Both categories are based on compact, radiation-hardened designs and are qualifiable for use in LEO, GEO, and Deep Space missions.

Volatile Memories

These solutions are used in onboard computers, telemetry units, and mission-critical real-time processing:

• DDR4 SDRAM: High-performance memory with high bandwidth and SEU resistance – ideal for data-intensive payloads.
• DDR3/DDR2/DDR SDRAM: Earlier generations with optimized power consumption, suitable for compact platforms.
• SDRAM: Standard solution for reliable real-time systems with minimal footprint.
• SRAM: Ultra-fast access times, ideal for cache or control paths.

Non-Volatile Memories

These components ensure secure data storage even in the event of power loss – essential for system boot, firmware, and mission data logging:

• NOR FLASH & SPI NOR FLASH: Robust code storage solutions offering high data integrity.
• RTIMS FLASH & NAND FLASH: High-capacity storage for large datasets with rugged construction.
• MRAM: Combines the benefits of RAM and non-volatile memory – fast, durable, and TID-resistant.
• EEPROM & PROM: Proven devices for rewritable configuration storage.
• MNEMOSYNE: A compact, fully qualified memory device with integrated controller – ready for immediate integration into space systems.

These memory solutions are available in a variety of form factors, interface options, and capacities – from space-saving single-chip modules to highly integrated multi-channel configurations. They support standardized bus architectures and are designed for demanding space and defense applications. Thanks to compatibility with 3D PLUS System-in-Package architectures, they can be seamlessly integrated into custom designs, enabling maximum power density with high design flexibility.

2. Processing Modules / Space Computer Cores

3D PLUS offers miniaturized, radiation-tolerant computer cores based on the LEON3FT SPARC V8 processor architecture. These highly integrated modules combine processor, memory blocks (SDRAM, NOR Flash, EEPROM), and communication interfaces such as SpaceWire and UART in a single, robust System-in-Package (SiP) solution.

Designed specifically for space applications and qualifiable according to ECSS standards, these modules are used in a wide range of missions – from main spacecraft onboard computers and telemetry data processing to autonomous subsystems requiring real-time operations.

An example is the FUSIO RT Space Computer Core, a scalable processing unit built on LEON3FT, targeting high-reliability systems for space and defense.

» More information about the FUSIO RT Space Computer Core from 3D PLUS

3. Interface Modules

To enable robust communication between subsystems in complex space architectures, 3D PLUS provides a range of interface modules specifically engineered for operation in harsh space environments. These include solutions supporting LVDS (Low-Voltage Differential Signaling) and LVT (Low Voltage TTL) technologies, which enable high-speed, noise-immune data transfer via differential lines.

These modules are ideal for interconnecting memory, processors, sensors, and telemetry systems. They offer low latency, high electromagnetic compatibility (EMC) robustness, and low power consumption – all key requirements for modern satellite and deep-space probe architectures.

Typical use cases include payload data handling, redundancy control, and distributed computing architectures. Thanks to their miniaturized design, these interfaces can be easily integrated into existing platforms.

» More information about the Interface Module LVDS and LVT from 3D PLUS

4. Imaging Solutions

3D PLUS designs high-performance space camera systems, engineered to operate reliably under extreme environmental conditions. The portfolio includes both standalone camera heads and modular multi-camera systems designed for various space applications.

• CASPEX 12 MP Camera
  High-resolution image sensor (4000 × 3000 pixels) with global shutter, optimized for Earth Observation missions requiring high detail accuracy.
• CASPEX 4 MP Camera
  Balanced solution in terms of resolution, power consumption, and size – ideal for CubeSats and small satellite platforms.
• CASPEX 1.3 MP SWIR Camera
  Short-Wave Infrared (SWIR) sensor for applications such as gas detection, thermal monitoring, and low-light observation.
• IRIS 4 MP Space Camera
  Integrated camera system featuring modular architecture and versatile interface compatibility (LVDS, SPI, I²C) – ideal for scientific missions and highly integrated satellite platforms.

All imaging systems are built with radiation-tolerant electronics, feature low mass and compact dimensions, and are qualifiable for LEO, MEO, and Deep Space missions. Their modular architecture allows for easy integration into existing payload platforms.

More information about the Miniaturized High-Performance Modules from 3D PLUS in Part 2

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