It is organized with 4 chips of 1Gbit + 1 chip for ECC. It is particularly well suited for use in high reliability, high performance and high density system applications, such as servers or workstations.
The 3D2D4G72UB3652 is packaged in a 191 balls BGA available with lead-free or leaded balls.

The 3D2D4G72UB3652 is a high-speed highly integrated DDR2 Synchronous Dynamic Ram Memory.
PERSONAL CONSULTATION
From component selection to design-in: our sales team advises you in person, by phone, video call or on site. We will set aside 30 minutes for you.
PERSÖNLICHE BERATUNG
Von der Bauteilauswahl bis zum Design-in: Unser Vertriebsteam berät Sie persönlich, telefonisch, per Videokonferenz oder vor Ort. Wir nehmen uns 30 Minuten Zeit.