6 Gbit DDR2 SDRAM (3D2D6G48UQ3694)

• Organized as 128Mx48
• Supply voltage: 1.8V +/- 0.1V
• JEDEC standard 1.8V I/O (SSTL_18 compatible)
• Max Data rate = 333 MHz
• Differential data strobe per byte
• 4n-bit prefetch architecture
• DLL to align DQ and DQS transitions with CK
• 6 internal banks per die for concurrent operation
• Programmable CAS Latency
• Posted CAS Additive Latency
• Write Latency = Read Latency – 1Tck
• Programmable Burst Lengths: 4 or 8
• On-Die Termination
• Available temperature range:
  • 0°C to +70°C
  • -40°C to +85°C
  • Specific temperature range can be requested
• Available with screening option for high reliability applications
  (Space, etc…)
• 3D PLUS DDR2 Radiation Hardened Solution:
  • TID > 100 krad(Si)
  • SEL immune > 68 MeV.cm²/mg
  • SEU immune by design
    (3.8E-9 upset/day/module with 3DIPMC700)
  • SEFI immune by design
    (with 3DIPMC700)

Description

It is particularly well suited for use in high reliability, high performance and high density system applications. The 3D2D6G48UQ3694 is packaged in a 144 QFP.

Downloads

• 3D Plus Memory Module P/N Decoder

Manufacturer Info

• www.3d-plus.com