How do engineers design a high-density interconnect when electrical requirements, limited space and mechanical loads all need to be considered? The connector is only one part of the solution. Cable construction, termination, shielding and mechanical integration must also be engineered together.
In our interview at Space Tech Expo Europe 2025, Scott Unzen of Omnetics Connector Corporation explains how the manufacturer is extending its Micro-D and Nano-D expertise into the development and manufacture of custom wire harnesses and cable assemblies. While our previously published High-Speed Nano-D article addressed transmission performance in miniature interfaces, this conversation examines the engineering of complete interconnect assemblies.
In addition to standard and custom connectors, Omnetics designs and manufactures associated cable and harness assemblies. Its documented capabilities include complex multi-branch harnesses, shielded interconnects, coaxial assemblies and configurations that combine signal, power and RF paths. These capabilities make it possible to consider electrical and mechanical interface requirements together during design-in.
An important point in Unzen’s interview is that a harness does not have to consist exclusively of Omnetics connectors. Connectors from other manufacturers required elsewhere in the system may also be incorporated in its design. Omnetics’ manufacturing information corroborates this capability. For systems engineers, it matters when one cable assembly must connect multiple subsystems using different interfaces.
Omnetics describes a direct engineer-to-engineer process, from requirements definition and prototyping through manufacturing. According to the manufacturer, CAD models, STEP files, drawings and printed prototypes support early mechanical integration. Available assembly processes include crimping and soldering, braided shielding, potting and overmolded strain relief. The appropriate choices depend on the specific assembly and environmental requirements.
For high-speed digital and RF links, mechanical fit is not enough. Cable construction, contact spacing, transitions and terminations affect impedance, insertion loss and reflections. Omnetics documents HFSS-based electromagnetic simulation, in-house signal integrity measurements and S-parameter models available on request. These are design and verification capabilities, not a blanket data-rate or RF-performance guarantee for every configuration.
Omnetics identifies IPC/WHMA-A-620 as the basis for its cable assembly, test and inspection practices. Documented testing capabilities include continuity, insulation resistance, dielectric withstand voltage, pull testing and temperature cycling. Test scope and acceptance criteria still need to be defined for each project. The availability of a test method does not establish that a particular assembly has successfully completed qualification.
The same distinction applies to military and space requirements. Omnetics is a QPL manufacturer for specified connector types under MIL-DTL-83513 and MIL-DTL-32139. This does not imply that all custom harnesses are QPL-approved or generally space-qualified. Part number, material selection, documentation and the agreed screening program remain decisive.
In the 2025 interview, Scott Unzen also outlined a prospective collaboration with Teledyne Storm Microwave to integrate NanoRF contacts into a Micro-D housing. This development has since moved beyond the planning stage: Omnetics and Teledyne Storm Microwave jointly introduced MultiFlex Micro-D in October 2026.
The solution incorporates VITA 67.3 NanoRF coaxial contacts within a Micro-D architecture and is described in RF-only and hybrid configurations with additional signal contacts. The manufacturer specifies up to 67 GHz with Storm Flex 047 cable, while the Storm Flex 034 configuration is rated up to 50 GHz. These values are configuration-dependent and should not be generalized to arbitrary cable and connector combinations.
When defining a custom interconnect assembly, engineering teams should establish signal types, channel count, routing constraints, contact and cable geometry, shielding, impedance requirements, mechanical loading and the required verification evidence. Space programs may add mission-specific requirements for materials, thermal exposure, outgassing and traceability. Actual performance limits must be evaluated against the selected and tested assembly, not inferred from an entire connector family.
Omnetics will join MSA Components as a co-exhibitor at Space Tech Expo Europe in Bremen from 17 to 19 November 2026. Visit the Omnetics specialists and our MSA team in Hall 5, Booth F11. Together with our technical contacts, you can discuss your application’s requirements for miniature connectors, custom cable assemblies, and testing and qualification concepts.
PERSONAL CONSULTATION
From component selection to design-in: our sales team advises you in person, by phone, video call or on site. We will set aside 30 minutes for you.
PERSÖNLICHE BERATUNG
Von der Bauteilauswahl bis zum Design-in: Unser Vertriebsteam berät Sie persönlich, telefonisch, per Videokonferenz oder vor Ort. Wir nehmen uns 30 Minuten Zeit.