More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer markets as smartphones, tablets and many handheld devices require advanced features in light and thin products. Currently, those requirements are being fulfilled by fan-in or package on package (PoP) technologies, but real 3D low-profile components are being introduced for specific applications.
The Felsic HV family of aluminum electrolytic screw terminal capacitors provides great performances in energy density and ultra-long lifetime. For instance, 6 800µF @450V fit into a volume of Ø77 x 220mm and can withstand 200,000h between 0 to 70° under 37Amps, which makes them the perfect choice for use in rolling stock traction systems or the CVS.
Exxelia is pleased to present a new unrivalled offer of Plug & Play TEMPEST filters for data centers and mission critical facilities.
Electronic equipment can leak sensitive information over conducted or radiated electromagnetic emanations, and signals transmitted down unprotected lines can potentially be intercepted. That’s why filters are implemented into systems to prevent EMI disturbances, as TEMPEST filters stop the high frequency EM signals (or noise) emanating inside the secured environment.