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3D Plus: Wire-free Die-on-die Technology for Electronic Module Manufacturing in Implantable Devices

MSA Components 18. April 2017 No Comments

More and more applications are calling for miniaturized electronics to integrate high-performance devices in a limited volume. 3D technology is being driven by the consumer markets as smartphones, tablets and…

Exxelia: Innovative Alumunim Electrolytic Capacitor Ranges at RailTex – booth #H02 –

MSA Components 14. April 2017 No Comments

Exxelia is pleased to exhibit at RailTex 2017 in Birmingham, United-Kingdom. From May 9th to 11th at booth #H02, Exxelia will be showcasing innovative ranges of Aluminum Electrolytic capacitors for…

Space Micro Introduces µLCT™ 100 Gpbs Lasercom Terminal

MSA Components 8. April 2017 No Comments

San Diego, CA – April 8, 2017 Space Micro Inc. introduced today its µLCT™ 100 Gpbs Lasercom Terminal. The µLCT™ is suitable for LEO constellation cross links as well as…

Sensitron: Sensitron’s SuperClamp TVS

MSA Components 31. March 2017 No Comments

High Power TVS SuperClamp Datasheet/Information

Exxelia: New Plug&Play filters for datacenters and mission critical facilities

MSA Components 15. March 2017 No Comments

Exxelia is pleased to present a new unrivalled offer of Plug & Play TEMPEST filters for data centers and mission critical facilities. Electronic equipment can leak sensitive information over conducted…

3D Plus: Launched on March, 7th 201, Sentinel 2B

MSA Components 9. March 2017 No Comments

Launched on March, 7th 201, Sentinel 2B is the second Sentinel-2 satellite launched as part of the Copernicus program, the world’s largest environmental monitoring program headed by the European Commission…

Exxelia: Innovative and Powerful Magnetic Solutions at APEC – booth #623 –

MSA Components 9. March 2017 No Comments

Exxelia will exhibit innovative ranges of wound magnetic components at 2017 Applied Power Electronics Conference, Tampa, FL, from March 27-30. Notable at Exxelia’s booth #623, will be products based on the highly customizable…

3D PLUS’ MEMORY MODULES ABOARD THE SPACEX CRS-10 MISSION

MSA Components 20. February 2017 No Comments

3D Plus memory modules integrated on four onboard computers used on the SpaceX CRS-10 mission. BUC, France, February 20th, 2017 – Launched on February 19th, 2017 from NASA’s Kennedy Space…

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