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64 Gbit DDR4, 1G x80 bits, 1.2 V (3D4D64G80LB2860)

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This 64 Gbit DDR4 is embedding 10 chips of 8 Gbit and 8 bus width. It can be typically used as 64 bits data + 16 bits ECC.

This organization allows the use of ECC to prevent data loss (8 bits of ECC are used to correct 8 bits of data). Furthermore, independent RESET capability is offered for customer to fine tune SEE mitigation.

Thus, this radiation tolerant DDR4 is particularly well suited for high reliability, performance, and density system applications such as computing memories. It is part of 3D PLUS’s DDR4 ecosystem, providing fully space qualified memory subsystem solution.

The 3D4D64G80LB2860 is packaged in BGA 363 with leaded balls.

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  • JEDEC JESD-79-4D compliant
  • Organization: 1G x (64 bits + 16 bits ECC)
  • Max Clock Rate: 1200 MHz
  • Max Transfer Rate: 2400 MT/s
  • Power Supply:
    • VDD = 1.2 V
    • VPP = 2.5 V
  • Independent ALERT_n
  • Independent RESET_n
  • Command Address Parity Check
  • Data Bus Write CRC (Cyclic Redundancy Check)
  • Programmable CAS Latency (CL): 9 to 16
  • Burst Length:
    • BL8 (Burst Length 8)
    • BC4 (Burst Chop 4)
    • Burst Chop 8 on the fly
  • Bi-directional Differential Data Strobe (DQS)
  • Programmable On-Die Termination (ODT)
  • Data Bus Inversion (DBI)
  • ZQ Calibration for DQ Drive and ODT
  • Available Temperature Ranges:
    • 0°C to +70°C
    • -40°C to +85°C
    • -55°C to +105°C

Radtiation Tolerance

  • Total Ionizing Dose (TID): > 100 krad
  • Single Event Latch-up (SEL): Immune up to LET > 62.8 MeV·cm²/mg
  • Single Event Upset (SEU): Protection and mitigation provided by RIMC DDR4

Description

The 3D4D64G80LB2860 is a high-speed, highlyintegrated DDR4 Synchronous Dynamic RAM designed for space applications.

Space Qualification

  • Qualified with 3D PLUS ESA certification per ESCC 2566001
  • Up to NASA Level 1
  • Long-Term Availability and High Reliability
  • Radiation-hardened, designed for high-end space computing applications
  • Flight Heritage:
    • More than 20 years of 3D PLUS expertise in space memories
    • Experience spanning SRAM, SDRAM, DDR1, DDR2, DDR3, and DDR4

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