This solution procures several key benefits:
- NX1H35AS© : NG Medium Space European FPGA
- STM C65-space Process technology
- Leading Edge European FPGA
- Significant board area reduction for customers designs
- High Modularity (Pinout compatible with all FUSIO RT Family)
- Proven radiation hardened design
- Available with screening option for high reliability application
More Features
- 263 Multi-Standards Users I/Os
- 128 Mbit SPI NOR Flash Configuration memory with integrated TMR and Power Switch for enhanced SEU and TID performances
- 64 Gbits NAND Flash storage memory
- 2 Gbits SDRAM computing memory
- High level of miniaturization : 483 ball BGA, 32 x 32 mm² area, module weight = 28 g
- Temperature Range: -40°C to +105°C
Radiation Tolerances:
- TID = 40 krads
- SEL immune up to LET > 60 MeV.cm2/mg