Fusio RT Full (3DMC0752 - 3DMC0753 - 3DMC0754 - 3DMC0755)

This solution procures several key benefits:

  • NX1H35AS© : NG Medium Space European FPGA
  • STM C65-space Process technology
  • Leading Edge European FPGA
  • Significant board area reduction for customers designs
  • High Modularity (Pinout compatible with all FUSIO RT Family)
  • Proven radiation hardened design
  • Available with screening option for high reliability application

More Features

  • 263 Multi-Standards Users I/Os
  • 128 Mbit SPI NOR Flash Configuration memory with integrated TMR and Power Switch for enhanced SEU and TID performances
  • 64 Gbits NAND Flash storage memory
  • 2 Gbits SDRAM computing memory
  • High level of miniaturization : 483 ball BGA, 32 x 32 mm² area, module weight = 28 g
  • Temperature Range: -40°C to +105°C

Radiation Tolerances:

  • TID = 40 krads
  • SEL immune up to LET > 60 MeV.cm2/mg

FUSIO RT FULL Configuration: 3DMC0752

  • 483 pins module, 263 users I/Os
  • FPGA + Integrated non-volatile flash NOR SPI memory of 128 Mbit each (triplicated)
  • 64 Gbit NAND Flash memory:
    • 64 Gb (4 x 16 Gb)
    • Bus width = 32b
    • Max Frequency = 40 MHz
    • Max Data Rate = 1600 Mb/s
  • 2 Gbit SDRAM memory :
    • 2 Gb (4 x 512 Mb)
    • Bus width = 32b
    • Max Frequency = 133 MHz
    • MaxData Rate = 4.2 Gb/s
  • BGA pitch = 1.27 mm

Additional Configurations:

  • FUSIO RT BASIC Configuration: 3DMC0753
    FPGA + FLASH NOR
  • FUSIO RT 3L NAND Configuration: 3DMC0754
    FPGA + FLASH NOR + FLASH NAND (64 Gb)
  • FUSIO RT 3L SDRAM Configuration: 3DMC0753
    FPGA + FLASH NOR + SDRAM (2 Gb)

Description

The 3DMC0754 FUSIO RT 3L NAND is the 3 layers configuration of a Computer Core integrating a space grade SRAM based FPGA with its configuration memory and an additional mass storage memory NAND in one miniaturized module.

More information

Downloads

Manufacturer Info

Fusio RT Full (3DMC0752 - 3DMC0753 - 3DMC0754 - 3DMC0755)

The 3DMC0754 FUSIO RT 3L NAND is the 3 layers configuration of a Computer Core integrating a space grade SRAM based FPGA with its configuration memory and an additional mass storage memory NAND in one miniaturized module.

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The 3DMC0754 FUSIO RT 3L NAND is manufactured using 3D PLUS well-known integration technology designed for high speed circuit applications. It is particularly well suited for use in high reliability, high performance and high-density system applications, as a fully integrated Computer Core.

This solution procures several key benefits:

  • NX1H35AS© : NG Medium Space European FPGA
  • STM C65-space Process technology
  • Leading Edge European FPGA
  • Significant board area reduction for customers designs
  • High Modularity (Pinout compatible with all FUSIO RT Family)
  • Proven radiation hardened design
  • Available with screening option for high reliability application

More Features

  • 263 Multi-Standards Users I/Os
  • 128 Mbit SPI NOR Flash Configuration memory with integrated TMR and Power Switch for enhanced SEU and TID performances
  • 64 Gbits NAND Flash storage memory
  • 2 Gbits SDRAM computing memory
  • High level of miniaturization : 483 ball BGA, 32 x 32 mm² area, module weight = 28 g
  • Temperature Range: -40°C to +105°C

Radiation Tolerances:

  • TID = 40 krads
  • SEL immune up to LET > 60 MeV.cm2/mg

FUSIO RT FULL Configuration: 3DMC0752

  • 483 pins module, 263 users I/Os
  • FPGA + Integrated non-volatile flash NOR SPI memory of 128 Mbit each (triplicated)
  • 64 Gbit NAND Flash memory:
    • 64 Gb (4 x 16 Gb)
    • Bus width = 32b
    • Max Frequency = 40 MHz
    • Max Data Rate = 1600 Mb/s
  • 2 Gbit SDRAM memory :
    • 2 Gb (4 x 512 Mb)
    • Bus width = 32b
    • Max Frequency = 133 MHz
    • MaxData Rate = 4.2 Gb/s
  • BGA pitch = 1.27 mm

Additional Configurations:

  • FUSIO RT BASIC Configuration: 3DMC0753
    FPGA + FLASH NOR
  • FUSIO RT 3L NAND Configuration: 3DMC0754
    FPGA + FLASH NOR + FLASH NAND (64 Gb)
  • FUSIO RT 3L SDRAM Configuration: 3DMC0753
    FPGA + FLASH NOR + SDRAM (2 Gb)

Description

The 3DMC0754 FUSIO RT 3L NAND is the 3 layers configuration of a Computer Core integrating a space grade SRAM based FPGA with its configuration memory and an additional mass storage memory NAND in one miniaturized module.

More information

Downloads

Manufacturer Info

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MSA Components GmbH
Am Glockenberg 13
57439 Attendorn
Germany
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