Fusio RT Nand (3DMC0754)

This solution procures several key benefits:

  • NX1H35AS© : NG Medium Space European FPGA
  • STM C65-space Process technology
  • Leading Edge European FPGA
  • Significant board area reduction for customers designs
  • High Modularity (Pinout compatible with all FUSIO RT Family)
  • Proven radiation hardened design
  • Available with screening option for high reliability application

128 Mbit SPI NOR Flash Configuration memory with:

  • Integrated Triple Modular Redundancy (TMR) and Power Switch
  • Enhanced SEU and TID performances

More Features

  • 64 Gbits NAND Flash storage memory
  • Power Supply: 1.2V, 2.5V, 3.3V
  • Configuration banks supplies: 2.5V, 3.3V
  • 483 pins module, 263 Multi-Standards users I/Os
  • High level of miniaturization : 483 ball BGA, 32 x 32mm² area, max. module weight = 22 g
  • Temperature Range: -40°C to +105°C

Radiation Tolerances:

  • TID = 40 krads
  • SEL immune up to LET > 60 MeV.cm2/mg

FUSIO RT 3L NAND Configuration: 3DMC0754

  • NG Medium Space European FPGA : NX1H35AS©
  • Integrated TMR non-volatile Flash NOR SPI memory of 128 Mbit each
  • 64 Gbit NAND Flash memory :
    • 64 Gb (4 x 16 Gb)
    • Bus width = 32b
    • Max Frequency = 40 MHz
    • Max Data Rate = 1600 Mb/s
  • BGA pitch = 1.27 mm
  • 483 pins module, 263 users I/Os

Additional Configurations:

  • FUSIO RT FULL Configuration: 3DMC0752
    FPGA + TMR FLASH NOR + FLASH NAND + SDRAM
  • FUSIO RT BASIC: 3DMC0753
    FPGA + FLASH NOR
  • FUSIO RT 3L SDRAM Configuration: 3DMC0755
    FPGA + FLASH NOR + SDRAM (2 Gb)

Description

The 3DMC0754 FUSIO RT 3L NAND is the 3 layers configuration of a Computer Core integrating a space grade SRAM based FPGA with its configuration memory and an additional mass storage memory NAND in one miniaturized module.

More information

Downloads

Manufacturer Info

Fusio RT Nand (3DMC0754)

The 3DMC0754 FUSIO RT 3L NAND is the 3 layers configuration of a Computer Core integrating a space grade SRAM based FPGA with its configuration memory and an additional mass storage memory NAND in one miniaturized module.

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The 3DMC0754 FUSIO RT 3L NAND is manufactured using 3D PLUS well-known integration technology designed for high speed circuit applications. It is particularly well suited for use in high reliability, high performance and high-density system applications, as a fully integrated Computer Core.

This solution procures several key benefits:

  • NX1H35AS© : NG Medium Space European FPGA
  • STM C65-space Process technology
  • Leading Edge European FPGA
  • Significant board area reduction for customers designs
  • High Modularity (Pinout compatible with all FUSIO RT Family)
  • Proven radiation hardened design
  • Available with screening option for high reliability application

128 Mbit SPI NOR Flash Configuration memory with:

  • Integrated Triple Modular Redundancy (TMR) and Power Switch
  • Enhanced SEU and TID performances

More Features

  • 64 Gbits NAND Flash storage memory
  • Power Supply: 1.2V, 2.5V, 3.3V
  • Configuration banks supplies: 2.5V, 3.3V
  • 483 pins module, 263 Multi-Standards users I/Os
  • High level of miniaturization : 483 ball BGA, 32 x 32mm² area, max. module weight = 22 g
  • Temperature Range: -40°C to +105°C

Radiation Tolerances:

  • TID = 40 krads
  • SEL immune up to LET > 60 MeV.cm2/mg

FUSIO RT 3L NAND Configuration: 3DMC0754

  • NG Medium Space European FPGA : NX1H35AS©
  • Integrated TMR non-volatile Flash NOR SPI memory of 128 Mbit each
  • 64 Gbit NAND Flash memory :
    • 64 Gb (4 x 16 Gb)
    • Bus width = 32b
    • Max Frequency = 40 MHz
    • Max Data Rate = 1600 Mb/s
  • BGA pitch = 1.27 mm
  • 483 pins module, 263 users I/Os

Additional Configurations:

  • FUSIO RT FULL Configuration: 3DMC0752
    FPGA + TMR FLASH NOR + FLASH NAND + SDRAM
  • FUSIO RT BASIC: 3DMC0753
    FPGA + FLASH NOR
  • FUSIO RT 3L SDRAM Configuration: 3DMC0755
    FPGA + FLASH NOR + SDRAM (2 Gb)

Description

The 3DMC0754 FUSIO RT 3L NAND is the 3 layers configuration of a Computer Core integrating a space grade SRAM based FPGA with its configuration memory and an additional mass storage memory NAND in one miniaturized module.

More information

Downloads

Manufacturer Info

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MSA Components GmbH
Am Glockenberg 13
57439 Attendorn
Germany
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