Fusio RT SDRAM (3DMC0755)

This solution procures several key benefits:

• NX1H35AS© : NG Medium Space European FPGA
• STM C65-space Process technology
• Leading Edge European FPGA
• Significant board area reduction for customers designs
• High Modularity (Pinout compatible with all FUSIO RT Family)
• Proven radiation hardened design
• Available with screening option for high reliability application

128 Mbit SPI NOR Flash Configuration memory with:

• Integrated Triple Modular Redundancy (TMR) and Power Switch
• Enhanced SEU and TID performances

More Features

• 2 Gbits SDRAM computing memory
• Power Supply: 1.2V, 2.5V, 3.3V
• Configuration banks supplies: 2.5V, 3.3V
• 483 pins module, 263 Multi-Standards users I/Os
• High level of miniaturization : 483 ball BGA, 32 x 32mm² area, max. module weight = 22 g
• Temperature Range: -40°C to +105°C

Radiation Tolerances:

• TID = 40 krads
• SEL immune up to LET > 60 MeV.cm2/mg

FUSIO RT 3L SDRAM Configuration: 3DMC0755

• 2 Gb (4 x 512 Mb)
• Bus width = 32b
• Max Frequency = 133 MHz
• MaxData Rate = 4.2 Gb/s

Additional Configurations:

• FUSIO RT FULL Configuration: 3DMC0752
  FPGA + TMR FLASH NOR + FLASH NAND + SDRAM
• FUSIO RT BASIC Configuration: 3DMC0753
  FPGA + FLASH NOR
• FUSIO RT 3L NAND Configuration: 3DMC0754
  FPGA + TMR FLASH NOR + FLASH NAND (64 Gb)

Description

The 3DMC0755 FUSIO RT 3L SDRAM is the 3 layers configuration of a Computer Core integrating a space grade SRAM based FPGA with its configuration memory and additional computing memory SDRAM in one miniaturized module.

More information

• FUSIO RT Computer Core from 3D PLUS

Downloads

• 3D Plus Memory Module P/N Decoder

Manufacturer Info

• www.3d-plus.com